5SGSMD4E3H29I3LN

The 5SGSMD4E3H29I3LN is a high-density Stratix® V GS field programmable gate array (FPGA) IC designed for industrial-grade applications. It delivers large logic capacity and on-chip memory in a compact 780-BBGA FCBGA package, supporting demanding designs that require extensive programmable logic, abundant I/O, and industrial temperature operation.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory and 360 I/Os, this device targets systems that need high integration of programmable logic and memory while operating across a wide temperature and low-voltage core range.

Key Features

• Core & Logic  360,000 logic elements for complex digital designs and large-scale FPGA implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Density  360 programmable I/Os to enable dense connectivity to peripherals, sensors, and high-speed interfaces.
• Power / Voltage  Core supply voltage range of 820 mV to 880 mV for the device core.
• Package & Mounting  780-BBGA, FCBGA package; supplier device package listed as 780-HBGA (33x33). Surface mount for PCB integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.
• Family  Part of the Stratix V device family with series-level electrical and switching characteristic documentation available for system-level design considerations.

Typical Applications

• High-performance communications  Leverage the device's large logic capacity and high I/O count for protocol processing, packet handling, and network interface implementations.
• Signal processing  Use on-chip memory and extensive logic resources for real-time DSP, filtering, and data-path acceleration tasks.
• Industrial control and automation  Industrial temperature rating and high integration make the device suitable for motor control, robotics logic, and factory automation controllers.
• Prototyping and complex system integration  Large logic and memory resources allow consolidation of multiple functions into a single FPGA for proof-of-concept and production designs.

Unique Advantages

• High integration: 360,000 logic elements combined with approximately 19.456 Mbits of embedded memory reduce the need for external components and simplify system architecture.
• Dense I/O connectivity: 360 I/Os support high-pin-count interfaces and enable flexible board-level partitioning of signals.
• Industrial temperature capability: Rated from −40 °C to 100 °C to support deployment in harsh and temperature-variable environments.
• Compact BGA package: 780-BBGA / 780-HBGA (33x33) packaging offers a space-efficient footprint for high-density PCB designs.
• Low-voltage core operation: 820 mV–880 mV supply supports modern power-optimized system designs.
• Regulatory compliance: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose 5SGSMD4E3H29I3LN?

The 5SGSMD4E3H29I3LN brings together substantial logic resources, significant embedded memory, and a high I/O count in a surface-mount 780-BBGA package rated for industrial temperatures. It is positioned for engineers and system designers who need a scalable, high-density FPGA platform within the Stratix V family to consolidate functions, reduce external components, and maintain reliable operation across a wide temperature range.

This device is well suited to complex communications, signal processing, and industrial control designs where integration, I/O density, and industrial-grade operation are primary requirements.

Request a quote or submit a procurement inquiry to evaluate the 5SGSMD4E3H29I3LN for your next high-density FPGA design.