5SGSMD4E3H29I3L

The 5SGSMD4E3H29I3L is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 780-ball BGA FCBGA package designed for industrial-grade embedded and system-level applications. It provides a high logic density with 360,000 logic elements and approximately 19.5 Mbits of on-chip RAM, along with 360 user I/O pins for complex I/O and system integration.

Manufactured for surface-mount assembly and rated for an operating temperature range of –40 °C to 100 °C, this device targets applications that require large programmable logic capacity, substantial embedded memory, and industry-grade environmental tolerance. The device operates from a core supply of 820 mV to 880 mV and is RoHS compliant.

Key Features

• Core Capacity  360,000 logic elements to support large-scale programmable designs and complex logic implementations.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM (Total Ram Bits: 19,456,000) for data buffering, state storage, and memory-intensive algorithms.
• I/O Count  360 user I/O pins to interface with wide parallel buses, multiple peripherals, and complex system I/O requirements.
• Power Supply  Core voltage range from 820 mV to 880 mV, enabling consistent core operation within the specified voltage window.
• Package & Mounting  780-ball BGA (FCBGA) surface-mount package; supplier device package listed as 780-HBGA (33 × 33 mm) for high-density board integration.
• Industrial Temperature Grade  Rated for –40 °C to 100 °C operation and specified as Industrial grade for extended-temperature deployments.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for hazardous substances.

Typical Applications

• High-density programmable logic  Large FPGA designs that require substantial logic element counts and embedded RAM for custom data-paths and control logic.
• System integration and prototyping  Boards and platforms that need significant I/O and on-chip memory to consolidate functions and accelerate development cycles.
• Industrial control and instrumentation  Deployments operating across a wide temperature range that benefit from industrial-grade rating and surface-mount packaging.

Unique Advantages

• High logic density: 360,000 logic elements provide the capacity to implement large and complex designs without immediate migration to a larger device.
• Substantial on-chip memory: Approximately 19.5 Mbits of RAM reduces external memory dependence and supports memory-intensive functions on-chip.
• Generous I/O availability: 360 I/Os simplify board-level design by offering broad connectivity options for peripherals, buses, and interfaces.
• Industrial temperature range: Rated for –40 °C to 100 °C to meet the demands of temperature-varied deployments.
• Industry-standard BGA packaging: 780-ball FCBGA (33 × 33 mm supplier package) facilitates high-density, surface-mount assembly on compact PCBs.
• Regulatory compliance: RoHS compliant to support environmental and regulatory requirements.

Why Choose 5SGSMD4E3H29I3L?

The 5SGSMD4E3H29I3L positions itself as a high-capacity Stratix® V GS FPGA option for engineers who need significant programmable logic, embedded memory, and extensive I/O in an industrial-grade package. Its combination of 360,000 logic elements, roughly 19.5 Mbits of on-chip RAM, and 360 I/Os supports complex system integration while the packaged form factor and surface-mount mounting enable compact board designs.

Designed for projects that require scalability, robust operation across a wide temperature range, and RoHS compliance, this device is suitable for developers building large programmable logic solutions and industrial systems that rely on reliable on-chip resources and board-level integration.

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