5SGSMD4E3H29I3G

The 5SGSMD4E3H29I3G is a Stratix V GS family Field Programmable Gate Array (FPGA) from Intel, offered in an industrial temperature grade. This device delivers high logic density and on-chip memory with extensive I/O, packaged in a 780-BBGA (FCBGA) format with a 33 × 33 supplier package footprint.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory and 360 I/O pins, the device is suited to designs requiring large programmable logic capacity, substantial embedded RAM and broad external connectivity while operating across a wide industrial temperature and low-voltage supply window.

Key Features

• Core density — 360,000 logic elements to implement large-scale programmable logic and complex digital functions.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables and intermediate storage.
• I/O capacity — 360 dedicated I/O pins to support extensive peripheral and bus interfacing requirements.
• Power supply — Operates from a core voltage supply range of 820 mV to 880 mV, enabling designs optimized for the device’s specified core operating window.
• Package and mounting — 780-BBGA, FCBGA package (supplier package 780-HBGA, 33×33) designed for surface-mount assembly in space-constrained, high-density board layouts.
• Industrial temperature grade — Specified operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
• RoHS compliant — Device is compliant with RoHS requirements.

Typical Applications

• High-density signal processing — Implement complex DSP algorithms and pipeline data paths using the device’s large logic capacity and embedded RAM.
• Network and communications equipment — Use the abundant I/O and on-chip resources to support protocol handling, packet processing and interface bridging.
• Industrial control and automation — Industrial temperature rating and extensive I/O make the device suitable for controllers, PLCs and machine-control logic that require robust programmable logic.

Unique Advantages

• Large programmable fabric: 360,000 logic elements provide headroom for complex SoC-style implementations without external logic expansion.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• High I/O count: 360 I/O pins simplify board-level connectivity and support multiple parallel interfaces or wide data buses.
• Industrial operating range: Qualified for −40 °C to 100 °C operation to meet the environmental demands of industrial applications.
• Compact, high-density package: 780-BBGA FCBGA (33 × 33) package enables dense PCB integration for space-constrained systems.
• RoHS compliance: Facilitates use in assemblies that require restricted-substance conformance.

Why Choose 5SGSMD4E3H29I3G?

The 5SGSMD4E3H29I3G positions itself as a high-density Stratix V GS FPGA option for designs that demand significant programmable logic, embedded RAM and broad I/O integration within an industrial-temperature, surface-mount package. Its combination of 360,000 logic elements, substantial on-chip memory and 360 I/Os supports complex data processing, interface aggregation and control tasks in a single device.

For engineering teams requiring a scalable, high-capacity FPGA platform with industrial temperature capability and a compact BGA footprint, this Stratix V GS device offers a verifiable specification set to drive robust, long-term deployments while remaining RoHS compliant.

Request a quote or submit an inquiry for pricing and availability of the 5SGSMD4E3H29I3G to evaluate its fit for your next high-density FPGA design.