5SGSMD4E3H29C3WN

The 5SGSMD4E3H29C3WN is a Stratix V GS family Field Programmable Gate Array (FPGA) IC from Intel. It delivers a large programmable fabric with 360,000 logic elements and embedded on-chip memory to support complex digital designs.

Designed for commercial-temperature applications, this device combines substantial logic capacity, approximately 19.46 Mbits of embedded memory, and a 360-pin I/O footprint in a 780-ball BGA surface-mount package to address high-density, memory-rich, and high-I/O FPGA implementations.

Key Features

• Core Logic 360,000 logic elements for implementing large digital functions and complex logic architectures.
• Embedded Memory Approximately 19.46 Mbits of total on-chip RAM bits to support storage, buffering, and data-path needs without external memory for many use cases.
• I/O Capacity 360 user I/O pins to accommodate demanding interfacing and multi-channel connectivity requirements.
• Power Supply Core voltage supply specified between 820 mV and 880 mV for device operation.
• Package & Mounting 780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33), with surface-mount mounting for compact board-level integration.
• Operating Grade & Temperature Commercial-grade device rated for an operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• High-density logic implementations — Use the 360,000 logic elements to consolidate complex digital functions into a single FPGA die for space- and integration-sensitive systems.
• Memory-intensive processing — Approximately 19.46 Mbits of embedded RAM supports buffering, packet processing, and on-chip data storage for mid-to-large scale designs.
• High-pin-count I/O systems — 360 I/O pins enable multi-channel interfaces, large peripheral sets, and flexible board-level connectivity.

Unique Advantages

• Large programmable fabric — 360,000 logic elements enable implementation of extensive logic networks and complex control algorithms on-chip.
• Substantial on-chip memory — Approximately 19.46 Mbits of RAM reduces dependence on external memory for many buffering and data-path applications.
• Broad I/O density — 360 I/O pins support dense interfacing options for multi-channel and multi-peripheral designs.
• Compact board footprint — 780-BBGA surface-mount package (33×33 HBGA supplier footprint) provides high integration in a single package for space-constrained PCBs.
• Commercial temperature rating — Specified 0 °C to 85 °C operating range for standard commercial deployments.
• Standards-conscious supply — RoHS compliance for environmental regulatory alignment.

Why Choose 5SGSMD4E3H29C3WN?

The 5SGSMD4E3H29C3WN positions itself as a highly integrated Stratix V GS FPGA option for commercial designs that require extensive logic resources, significant on-chip memory, and a large I/O complement. Its 780-ball BGA surface-mount package and defined supply and temperature envelope make it suitable for dense board-level implementations where on-chip capacity and pin count are primary drivers.

Engineers and procurement teams targeting scalable, memory-capable FPGA solutions will find the specification set—360,000 logic elements, approximately 19.46 Mbits of embedded RAM, 360 I/Os, and a 820–880 mV core voltage range—useful for evaluating fit against system requirements and long-term project roadmaps.

Request a quote or submit a pricing inquiry for the 5SGSMD4E3H29C3WN to receive availability and purchasing information tailored to your project needs.