5SGSMD4E3H29C2N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 81 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E3H29C2N – Stratix® V GS FPGA, 360,000 logic elements, 780‑BBGA

The 5SGSMD4E3H29C2N is an Intel Stratix® V GS field-programmable gate array in a 780‑ball BGA (FCBGA) package. Built on a 28‑nm Stratix V architecture, this GS variant targets transceiver‑based, DSP‑centric designs that require large logic, abundant on‑chip memory, and integrated high‑speed transceivers.

This commercial‑grade device delivers a combination of programmable logic (360,000 logic elements), approximately 19.456 Mbits of embedded memory, and a high count of I/O (360 pins), making it suitable for data‑intensive signal processing and high‑bandwidth interface applications within its 0 °C to 85 °C operating range.

Key Features

  • Core and process – 28‑nm Stratix V architecture with a documented device core operating voltage range of 870 mV to 930 mV.
  • Logic capacity – 360,000 logic elements to implement complex custom logic and control functions.
  • Embedded memory – Approximately 19.456 Mbits of on‑chip RAM backed by 20 Kbit (M20K) embedded memory blocks for buffering, packet storage, and lookup tables.
  • High‑precision DSP – GS variant includes variable‑precision DSP resources, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for intensive signal processing tasks.
  • Integrated transceivers – GS devices offer integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interface applications.
  • I/O and package – 360 available I/Os in a 780‑BBGA FCBGA supplier package (780‑HBGA, 33×33), designed for surface‑mount assembly.
  • Embedded hard IP – Includes an Embedded HardCopy Block to support hardened IP instantiation (example: PCIe Gen1/Gen2/Gen3 hardening per Stratix V family documentation).
  • Commercial temperature and compliance – Rated for 0 °C to 85 °C operation and RoHS‑compliant.

Typical Applications

  • High‑performance digital signal processing – Leverage the large DSP fabric and multiplier density for filtering, FFTs, and precision computations in broadcast and compute applications.
  • Backplane and optical communications – Integrated 14.1‑Gbps transceivers and abundant logic make the device suitable for packet processing, line‑rate framing, and protocol handling for 40G/100G links.
  • Network and packet processing – Use the combination of logic, memory, and I/O to implement traffic management, packet inspection, and custom acceleration functions.
  • Military and broadcast signal processing – Apply variable‑precision DSP resources and high I/O density where real‑time, high‑throughput processing is required (device grade: commercial).

Unique Advantages

  • Large programmable fabric: 360,000 logic elements provide the capacity to integrate complex control, datapath, and interface logic on a single device, reducing board-level BOM.
  • Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM (M20K blocks) for packet buffering, lookup tables, and low‑latency data storage.
  • High DSP throughput: Variable‑precision DSP blocks with thousands of multipliers enable efficient implementation of compute‑intensive signal processing algorithms.
  • Integrated transceiver performance: 14.1‑Gbps capable transceivers on the GS variant support high‑speed serial links for backplane and optical interfaces.
  • Hardened IP support: Embedded HardCopy Block facilitates hardened instantiation of PCIe Gen1/Gen2/Gen3 IP, streamlining integration of common protocols.
  • Commercial readiness: Surface‑mount 780‑BBGA package and RoHS compliance simplify manufacturing and regulatory alignment for commercial products.

Why Choose 5SGSMD4E3H29C2N?

The 5SGSMD4E3H29C2N combines the Stratix V GS family’s DSP density, significant on‑chip memory, and integrated transceivers in a high‑I/O BGA package, making it a focused solution for designs that require high throughput and extensive signal processing. Its documented voltage and temperature ranges and RoHS compliance support commercial production and deployment.

This device is well suited to engineers and system designers building data‑intensive communications, broadcast, or compute acceleration solutions that need programmable flexibility alongside hardened IP options and high‑speed serial interfaces.

Please request a quote or submit an RFQ to get pricing and availability for the 5SGSMD4E3H29C2N. Our team can assist with volume options and lead‑time guidance.

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