5SGSMD4E3H29C3G

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 1,106 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E3H29C3G – Stratix® V GS Field Programmable Gate Array (FPGA), 360K logic elements, 780-BBGA

The 5SGSMD4E3H29C3G is a Stratix V GS family Field Programmable Gate Array (FPGA) in a 780-ball BGA package. It delivers high-density programmable logic, substantial on-chip RAM, and a large I/O count for advanced FPGA designs in commercial applications.

Designed as part of the Stratix V family, the device’s published documentation covers electrical and switching characteristics, including transceiver specifications and I/O timing, enabling system-level planning for power, timing, and interface requirements.

Key Features

  • Core Logic Capacity 360,000 logic elements are available to implement complex custom logic, algorithmic accelerators, and large state machines.
  • Embedded Memory Approximately 19.5 Mbits of on-chip RAM (19,456,000 bits) to support buffering, packet handling, and intermediate data storage.
  • I/O Density 360 user I/O pins to support broad connectivity and parallel interfaces across multiple peripherals and subsystems.
  • Power Core supply range from 0.820 V to 0.880 V to match platform power-rail requirements and help with system-level power budgeting.
  • Package & Mounting 780-ball BGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount construction for standard PCB assembly processes.
  • Operating Range Commercial-grade device rated for 0 °C to 85 °C operation.
  • Compliance RoHS compliant for global manufacturing and environmental requirements.
  • Family Documentation Stratix V device datasheet provides detailed electrical, switching, and I/O timing specifications for system design and validation.

Typical Applications

  • High‑performance networking Implement packet processing, switching logic, and custom forwarding engines leveraging high logic capacity and abundant I/O.
  • Telecommunications equipment Use on-chip RAM and dense logic to build protocol engines and line-rate interface controllers for telecom systems.
  • Compute accelerators Deploy custom hardware accelerators and offload tasks from CPUs using the device’s sizable logic and memory resources.
  • Signal processing and instrumentation Implement real-time data paths, filtering, and aggregation where large on-chip RAM and numerous I/O are required.

Unique Advantages

  • Large programmable fabric: 360,000 logic elements enable implementation of substantial custom logic and parallel processing architectures on a single device.
  • Significant embedded memory: Approximately 19.5 Mbits of on-chip RAM reduces external memory dependence for many buffering and temporary-storage needs.
  • High I/O availability: 360 I/O pins simplify system integration with multiple high-speed interfaces or parallel buses.
  • Commercial temperature support: Rated for 0 °C to 85 °C operation for mainstream commercial deployments.
  • RoHS compliant: Supports environmentally conscious manufacturing and regulatory requirements.

Why Choose 5SGSMD4E3H29C3G?

This Stratix V GS FPGA balances high logic density, substantial embedded memory, and broad I/O capability in a single 780-ball BGA package, making it a practical choice for commercial designs that require on-chip resources and flexible interfacing. Its documented electrical and switching characteristics support detailed system-level design and verification.

The device is best suited for engineering teams building complex, high‑integration FPGA solutions such as networking, telecom, compute acceleration, and signal-processing systems that benefit from the combination of logic capacity, embedded RAM, and a large I/O complement.

Request a quote or submit an inquiry to discuss pricing, availability, and lead time for 5SGSMD4E3H29C3G. Our team can provide ordering information and support to evaluate the device for your design.

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