5SGSMD4E3H29C4N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 264 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E3H29C4N – Stratix V GS FPGA, 360,000 logic elements, 780‑BBGA

The 5SGSMD4E3H29C4N is a Stratix® V GS field programmable gate array packaged in a 780‑ball BGA (FCBGA). Built on Stratix V family architecture, this device combines high logic capacity, abundant embedded memory, integrated DSP resources and transceiver capability for demanding, transceiver‑based DSP and high‑bandwidth applications.

This commercial‑grade, surface‑mount FPGA is targeted at designs that require dense logic, significant on‑chip RAM and integrated high‑speed I/O in a 33×33 780‑HBGA footprint, while offering a production path to HardCopy® V ASICs as indicated for the Stratix V family.

Key Features

  • Logic Capacity  Approximately 360,000 logic elements to implement large, complex designs and system accelerators.
  • Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM, supported by the Stratix V family’s 20‑Kbit (M20K) memory block architecture for efficient buffering and data storage.
  • DSP and Numeric Acceleration  Stratix V GS family includes variable‑precision DSP blocks and supports large counts of multipliers for high‑performance signal processing tasks.
  • High‑Speed Transceivers  GS devices in the Stratix V family provide integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interface requirements.
  • I/O and Package  360 user I/Os in a surface‑mount 780‑BBGA (supplier package: 780‑HBGA, 33×33 mm) to accommodate dense board routing and high‑pin‑count system interfaces.
  • Power and Operating Range  Core supply range of 0.820 V to 0.880 V and commercial operating temperature range of 0 °C to 85 °C.
  • System Integration  Includes family features such as redesigned adaptive logic modules (ALMs), multi‑track routing, fractional PLLs and an Embedded HardCopy Block for hardened IP instantiation (PCIe Gen1/Gen2/Gen3 referenced in device family documentation).
  • Compliance  RoHS compliant.

Typical Applications

  • Transceiver‑based DSP systems  High‑precision digital signal processing in wireline, broadcast and high‑performance computing applications that benefit from integrated DSP blocks and transceivers.
  • Network and Optical Transport  Data‑intensive applications such as 40G/100G optical transport and packet processing where on‑chip memory and high‑speed I/O are critical.
  • Military and Aerospace DSP  Signal chain acceleration and protocol handling in military communications systems that require dense logic and embedded memory (commercial‑grade temperature range applies).
  • PCIe‑enabled Systems  Systems leveraging PCI Express protocols for high‑speed host interfaces, using family hard IP and embedded hardcopy capabilities for prototyping and production transition.

Unique Advantages

  • High logic density:  Approximately 360,000 logic elements enable consolidation of complex functions and system‑level acceleration on a single device.
  • Substantial on‑chip RAM:  Roughly 19.456 Mbits of embedded memory reduces external memory dependence for buffering, lookup tables and real‑time data processing.
  • Integrated DSP and transceivers:  Variable‑precision DSP resources combined with 14.1‑Gbps capable transceivers simplify implementation of high‑bandwidth signal chains and serial interfaces.
  • Production path to hard ASIC:  Stratix V family documentation identifies a low‑risk, low‑cost migration path to HardCopy V ASICs for higher volume production.
  • Compact, board‑level form factor:  780‑BBGA (33×33 mm) surface‑mount package supports high‑pin density in space‑constrained designs.
  • Commercial suitability:  Grade and operating range targeted for commercial applications with RoHS compliance.

Why Choose 5SGSMD4E3H29C4N?

The 5SGSMD4E3H29C4N positions itself as a high‑capacity Stratix V GS FPGA that brings together large logic resources, significant embedded RAM and integrated DSP/transceiver capabilities in a compact 780‑ball BGA package. It is well suited for designers building transceiver‑centric DSP systems, high‑bandwidth networking equipment and data‑intensive accelerators where on‑chip integration reduces board complexity.

For teams planning prototyping and volume production, this device leverages Stratix V family features—such as embedded hard IP and a documented path to HardCopy V ASICs—to help manage development risk and enable migration from FPGA to hardened ASIC implementations.

Request a quote or submit an inquiry for pricing and availability of 5SGSMD4E3H29C4N to begin evaluation and procurement.

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