5SGSMD4E3H29I3N

The 5SGSMD4E3H29I3N is a Stratix V GS field-programmable gate array (FPGA) IC from Intel designed for high-density, programmable logic integration. With 360,000 logic elements and approximately 19.456 Mbits of on-chip RAM, this device targets designs that require substantial logic capacity and embedded memory.

Packaged in a 780-ball FCBGA (supplier package: 780-HBGA, 33×33) and rated for industrial operation, the device provides a high I/O count and defined core voltage range to support robust system-level integration in temperature-sensitive environments.

Key Features

• Logic Capacity  360,000 logic elements and approximately 135,840 logic blocks (device-reported) for implementing large, complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support memory-intensive functions and reduce external memory needs.
• I/O Count  360 general-purpose I/Os to support high pin-count interfacing and dense board-level connectivity.
• Packaging & Mounting  780-BBGA (FCBGA) package with supplier device package 780-HBGA (33×33); surface-mount design suitable for board-level integration.
• Power  Core voltage supply specified from 820 mV to 880 mV for defined power planning and supply design.
• Industrial Temperature Grade  Operating range from −40 °C to 100 °C, suitable for industrial-temperature deployments.
• RoHS Compliance  Device is RoHS compliant, supporting environmental and regulatory requirements.

Typical Applications

• High-density digital processing  Large-scale combinational and sequential logic implementations that benefit from deep logic resources.
• Memory-intensive subsystems  On-chip RAM supports buffering, lookup tables, and local data storage to minimize external memory dependence.
• High I/O count systems  Applications requiring extensive board-level interfacing or parallel I/O may leverage the device’s 360 I/Os.
• Industrial control and instrumentation  Industrial-grade temperature rating and surface-mount packaging make the device suitable for industrial environments.

Unique Advantages

• Large programmable fabric: 360,000 logic elements offer the headroom to implement complex custom logic and integration of multiple subsystems on a single device.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces the need for external memory components and simplifies board-level design.
• High I/O density: 360 I/Os enable dense connectivity for parallel interfaces, sensor arrays, and multi-channel systems.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in temperature-challenging industrial applications.
• Defined power envelope: Core supply range of 820 mV to 880 mV aids precise power-supply design and thermal planning.
• RoHS-compliant package: Meets lead-free requirements for modern manufacturing and regulatory needs.

Why Choose 5SGSMD4E3H29I3N?

The 5SGSMD4E3H29I3N delivers a compelling combination of high logic density, significant on-chip RAM, and a large I/O count within a 780-ball FCBGA package. Its industrial temperature rating and defined core-voltage window make it suitable for demanding embedded systems where integration, deterministic behavior, and thermal robustness matter. As a member of the Stratix V family, this device aligns with the published device datasheet and provides the documented electrical and switching characteristics engineers rely on for system design.

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