5SGSMD4H1F35C2L

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 400 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H1F35C2L – Stratix® V GS Field Programmable Gate Array (FPGA), 360,000 logic elements, 1152-BBGA

The 5SGSMD4H1F35C2L is an Intel Stratix V GS FPGA in a 1152-ball FCBGA package delivering 360,000 logic elements and an abundant DSP-capable fabric. Built on the Stratix V family architecture, it combines a 28‑nm process, high-density logic, embedded memory, and integrated transceivers to address DSP-centric, transceiver-based, and data-intensive applications.

This commercial-grade, surface-mount device provides robust I/O (432 pins), approximately 19.46 Mbits of embedded memory, and a core supply range of 820 mV to 880 mV, making it suitable for high-bandwidth communication, signal processing, and high-performance compute designs.

Key Features

  • High Logic Density — 360,000 logic elements for large-scale, parallel logic implementations and complex system integration.
  • Embedded Memory — Approximately 19.46 Mbits of on-chip RAM organized in M20K blocks for buffering, packet storage, and DSP data paths.
  • DSP Resources — Stratix V GS family DSP architecture with variable-precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-throughput signal processing.
  • Integrated Transceivers — GS variant transceivers with up to 14.1 Gbps data-rate capability for backplane and optical interface applications.
  • I/O and Packaging — 432 user I/Os in a 1152-BBGA (35 × 35 mm) FCBGA package, surface-mount for compact board-level integration.
  • Process and Fabric — 28‑nm TSMC process with a redesigned adaptive logic module (ALM) and multi-track routing architecture for predictable timing and routing resources.
  • Clocking and Hard IP — Fractional PLLs and an Embedded HardCopy Block for hardened IP instantiations such as PCIe Gen3/Gen2/Gen1.
  • Power and Thermal — Core supply range of 820 mV–880 mV; commercial operating temperature 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑Performance DSP Systems — Use in broadcast, military, or computing applications that require extensive multiply-accumulate resources and precision DSP processing.
  • Optical and Backplane Interfaces — Integrated high-speed transceivers enable 40G/100G optical transport, backplane links, and optical test equipment.
  • Packet Processing and Networking — Suitable for wireline networking, traffic management, and packet-processing platforms that demand high I/O and deep buffering.
  • Data‑Intensive Communications — Platforms requiring high bandwidth and large on-chip memory for packet buffering, framing, and protocol handling.

Unique Advantages

  • Highly Parallel DSP Capability: Large array of variable-precision DSP blocks enables dense multiply/accumulate operations and flexible precision trade-offs.
  • Integrated High‑Speed SerDes: 14.1 Gbps transceiver capability on GS devices simplifies design of high-bandwidth links and optical interfaces.
  • Substantial On‑Chip Memory: Approximately 19.46 Mbits of embedded RAM (M20K blocks) reduces external memory dependency and improves system latency.
  • Large Logic Resource Pool: 360,000 logic elements support complex control, protocol, and data-path implementation in a single device.
  • Production Path to ASIC: Stratix V family supports a low-risk path to HardCopy V ASICs for volume production and cost optimization.
  • Compact Board-Level Integration: 1152-BBGA (35×35 mm) FCBGA packaging with 432 I/Os provides high connectivity in a compact footprint.

Why Choose 5SGSMD4H1F35C2L?

The 5SGSMD4H1F35C2L brings together Stratix V GS family innovations—high logic density, ample DSP and embedded memory resources, and integrated transceivers—in a commercial-grade, surface-mount FCBGA package. It is positioned for designers who require a balanced combination of compute, memory, and high-speed I/O for DSP-centric and data-intensive systems.

This device is well suited for engineering teams building high-bandwidth communications equipment, optical and backplane interfaces, and compute platforms that benefit from on-chip memory and extensive DSP resources. The Stratix V family architecture and Embedded HardCopy capabilities also provide a clear path for prototyping and scaling to production ASICs.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the 5SGSMD4H1F35C2L. Our team can provide technical and procurement support to match this FPGA to your application requirements.

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