5SGSMD4E2H29I3LN

The 5SGSMD4E2H29I3LN is a Stratix® V GS family FPGA provided in a 780‑BBGA (FCBGA) package. It delivers a high-density programmable fabric with 360,000 logic elements and approximately 19.456 Mbits of embedded RAM for implementing large, complex digital designs.

Built for industrial environments, this surface-mount FPGA offers 360 user I/Os, a low-voltage core operating range of 820 mV to 880 mV, and an operating temperature range of –40°C to 100°C, making it suitable for designs that require high logic capacity and broad temperature tolerance.

Key Features

• High-density logic — 360,000 logic elements to support complex custom logic, large state machines, and wide datapath implementations.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM for buffers, lookup tables, and data storage close to logic.
• Rich I/O — 360 I/O pins to accommodate extensive interfacing and parallel connectivity requirements.
• Industrial temperature grade — Rated to operate from –40°C to 100°C for deployment in demanding thermal environments.
• Low-voltage core — Core supply range of 820 mV to 880 mV to match low-voltage system requirements.
• Package and mounting — 780‑BBGA (FCBGA) package in a 780‑HBGA (33x33) supplier designation, designed for surface-mount PCB assembly.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-density computing — Use the large logic element count and on-chip RAM to implement complex algorithms, accelerators, and wide datapaths.
• Telecommunications and networking — 360 I/Os and high logic capacity enable packet processing, protocol implementation, and custom switch/router functions.
• Industrial control and instrumentation — Industrial temperature rating and robust I/O support control systems, signal conditioning, and custom automation logic.

Unique Advantages

• Large programmable fabric: 360,000 logic elements provide substantial capacity for consolidating multiple functions into a single device.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces off-chip memory needs and improves latency for buffering and state storage.
• Extensive I/O count: 360 user I/Os simplify board routing and enable broad connectivity without additional multiplexing.
• Industrial-grade thermal range: Operation from –40°C to 100°C supports deployment in challenging environmental conditions.
• Compact FCBGA package: 780‑BBGA (supplier package: 780‑HBGA (33x33)) provides a high-pin-count solution in a surface-mount form factor.
• Low-voltage core operation: 820 mV–880 mV core supply aligns with modern low-voltage power domains to optimize system power architecture.
• Standards-aligned manufacturing: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGSMD4E2H29I3LN?

The 5SGSMD4E2H29I3LN combines high logic density, substantial embedded memory, and a large I/O count in a surface-mount 780‑BBGA package, positioned for industrial-grade applications that require significant on-chip resources and broad temperature tolerance. Its low-voltage core range and RoHS compliance make it suitable for modern system architectures where power and regulatory considerations matter.

This device is aimed at designers who need to consolidate complex digital functions into a single FPGA, reduce external memory and I/O component count, and deploy solutions across demanding temperature envelopes. As part of the Stratix® V family, it is documented in the device datasheet and related technical materials for design integration and electrical characterization.

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