5SGSMD4E2H29I3L

The 5SGSMD4E2H29I3L is a Stratix V GS Field Programmable Gate Array (FPGA) offered in an industrial temperature grade and supplied in a 780-ball FCBGA package. The device provides 360,000 logic elements and approximately 19.456 Mbits of on-chip RAM, making it suitable for complex, high-density FPGA designs that require a large logic fabric and significant embedded memory.

With 360 user I/Os, a low-voltage core supply (820 mV to 880 mV), and an operating temperature range of -40 °C to 100 °C, this FPGA is specified for industrial applications where broad temperature tolerance and dense integration are required.

Key Features

• Logic Capacity — 360,000 logic elements to implement large-scale programmable logic, custom datapaths, and application-specific architectures.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffers, FIFOs, and cache-like storage close to logic to reduce external memory dependence.
• I/O Density — 360 user I/Os to support wide parallel interfaces, high-pin-count system integration, and multiple peripheral connections.
• Power and Core Voltage — Core supply range from 820 mV to 880 mV, enabling compatible power-rail design for the FPGA core.
• Package & Mounting — 780-BBGA (FCBGA) package (supplier device package: 780-HBGA, 33×33) in a surface-mount form factor for high-density PCB assembly.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet industrial thermal requirements.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• Industrial Control Systems — Implement complex control logic, real-time processing, and multiple sensor/actuator interfaces within an industrial temperature envelope.
• Networking & Infrastructure — Implement packet processing, protocol bridging, and wide parallel I/O fabrics enabled by the large logic and I/O resources.
• Signal Processing & Acceleration — Host DSP pipelines, custom accelerators, and buffering with substantial on-chip RAM and extensive logic resources.

Unique Advantages

• Large Logic Fabric: 360,000 logic elements provide the headroom to realize complex algorithms and multi-function designs without immediate partitioning across multiple devices.
• Significant Embedded Memory: Approximately 19.456 Mbits of on-chip RAM reduces the need for external memory for many buffering and caching tasks, simplifying board design.
• High I/O Count: 360 user I/Os allow direct connectivity to numerous peripherals and high-throughput parallel interfaces, minimizing external interface logic.
• Industrial Thermal Range: Specified operation from -40 °C to 100 °C supports deployment in demanding temperature environments common to industrial equipment.
• Compact, Surface-Mount Package: 780-ball FCBGA (33 × 33) package enables dense PCB implementations and scalable system integration.
• Low-Voltage Core Compatibility: The 820 mV–880 mV core supply range supports modern low-voltage power architectures.

Why Choose 5SGSMD4E2H29I3L?

The 5SGSMD4E2H29I3L Stratix V GS FPGA combines a large logic element count, substantial embedded RAM, and a high I/O count in a single industrial-grade FCBGA package. Its electrical characteristics and operating conditions are documented in the Stratix V device datasheet, providing engineers with the necessary specifications for integrating this device into robust, temperature-tolerant systems.

This device is well suited to designers and system architects working on industrial control, networking infrastructure, and signal-processing applications who need dense programmable logic, on-chip memory, and a reliable, surface-mount package for compact board designs.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGSMD4E2H29I3L Stratix V GS FPGA.