5SGSMD4E2H29I2N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 752 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E2H29I2N – Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

The 5SGSMD4E2H29I2N is a Stratix V GS series FPGA in a 780-BBGA (FCBGA) package, designed for high-performance, DSP-centric and transceiver-based applications. Built on a 28‑nm Stratix V architecture, the device combines a large fabric of logic elements with extensive embedded memory and integrated high-speed transceivers to address bandwidth- and compute-intensive markets.

Key values for system designers include a fabric with 360,000 logic elements, approximately 19.456 Mbits of on-chip RAM, 360 I/O pins, industrial operating range, and a low-voltage core supply window for optimized power design.

Key Features

  • 28‑nm Stratix V architecture  Redesigned adaptive logic module (ALM) and multi-track routing for high-performance logic implementation.
  • Logic capacity  360,000 logic elements for large-scale custom logic and control functions.
  • Embedded memory  Approximately 19.456 Mbits of on-chip RAM using M20K embedded memory blocks for buffering, packet processing, and temporary storage.
  • Variable‑precision DSP  GS-family devices include abundant DSP resources; the family supports up to 3,926 18×18 or 1,963 27×27 multipliers for high-throughput signal processing workloads.
  • Integrated transceivers  GS devices provide integrated transceivers with 14.1 Gbps data-rate capability suitable for backplane and optical interface applications.
  • I/O and package  360 I/O pins in a surface-mount 780‑BBGA (supplier package 780‑HBGA, 33×33) footprint to support dense board-level connectivity.
  • Power  Core supply range from 870 mV to 930 mV to support low-voltage system designs.
  • Industrial temperature range  Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • Mounting and compliance  Surface-mount package construction; RoHS compliant.

Typical Applications

  • High‑performance DSP systems  Deploy variable‑precision DSP blocks and large multiplier counts for signal processing, filtering, and algorithm acceleration.
  • Optical and backplane interfaces  Integrated 14.1 Gbps transceivers make the device suitable for optical transport and high-speed backplane applications.
  • Telecom and networking equipment  Large logic and memory resources support packet processing, traffic management, and protocol offload functions.
  • Broadcast and military communications  High-density logic and DSP resources enable compute‑intensive processing used in broadcast and secure communications equipment.

Unique Advantages

  • High logic density: 360,000 logic elements provide a large programmable fabric for complex SoC-level designs and system integration.
  • Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM (M20K blocks) reduces external memory dependency and improves data throughput.
  • DSP-oriented resources: GS-family variable precision DSP blocks and multiplier support accelerate compute-heavy signal processing without external accelerators.
  • Integrated high-speed transceivers: 14.1 Gbps transceivers on GS devices streamline high-bandwidth link implementation for optical and backplane interfaces.
  • Industrial operating range: −40 °C to 100 °C rating helps maintain reliable operation in demanding environmental conditions.
  • Compact, high‑pin package: 780‑BBGA surface-mount package with 360 I/O supports dense connectivity while minimizing board area.

Why Choose 5SGSMD4E2H29I2N?

The 5SGSMD4E2H29I2N combines the Stratix V GS family’s high logic capacity, sizable on-chip memory, DSP resources, and integrated 14.1 Gbps transceivers in a compact 780‑BBGA package. These characteristics make it well suited for designs that require substantial programmable compute, high I/O density, and robust signal‑processing capability within an industrial temperature envelope.

Choose this FPGA for projects that need scalable logic and memory resources, integrated transceiver links, and the Stratiх V family’s architecture for high-performance, DSP-focused applications. The device’s voltage, thermal, and packaging details support practical system-level integration and long-term deployment in industrial environments.

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