5SGSMD4E2H29I2N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA |
|---|---|
| Quantity | 752 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4E2H29I2N – Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA
The 5SGSMD4E2H29I2N is a Stratix V GS series FPGA in a 780-BBGA (FCBGA) package, designed for high-performance, DSP-centric and transceiver-based applications. Built on a 28‑nm Stratix V architecture, the device combines a large fabric of logic elements with extensive embedded memory and integrated high-speed transceivers to address bandwidth- and compute-intensive markets.
Key values for system designers include a fabric with 360,000 logic elements, approximately 19.456 Mbits of on-chip RAM, 360 I/O pins, industrial operating range, and a low-voltage core supply window for optimized power design.
Key Features
- 28‑nm Stratix V architecture Redesigned adaptive logic module (ALM) and multi-track routing for high-performance logic implementation.
- Logic capacity 360,000 logic elements for large-scale custom logic and control functions.
- Embedded memory Approximately 19.456 Mbits of on-chip RAM using M20K embedded memory blocks for buffering, packet processing, and temporary storage.
- Variable‑precision DSP GS-family devices include abundant DSP resources; the family supports up to 3,926 18×18 or 1,963 27×27 multipliers for high-throughput signal processing workloads.
- Integrated transceivers GS devices provide integrated transceivers with 14.1 Gbps data-rate capability suitable for backplane and optical interface applications.
- I/O and package 360 I/O pins in a surface-mount 780‑BBGA (supplier package 780‑HBGA, 33×33) footprint to support dense board-level connectivity.
- Power Core supply range from 870 mV to 930 mV to support low-voltage system designs.
- Industrial temperature range Rated for operation from −40 °C to 100 °C for use in industrial environments.
- Mounting and compliance Surface-mount package construction; RoHS compliant.
Typical Applications
- High‑performance DSP systems Deploy variable‑precision DSP blocks and large multiplier counts for signal processing, filtering, and algorithm acceleration.
- Optical and backplane interfaces Integrated 14.1 Gbps transceivers make the device suitable for optical transport and high-speed backplane applications.
- Telecom and networking equipment Large logic and memory resources support packet processing, traffic management, and protocol offload functions.
- Broadcast and military communications High-density logic and DSP resources enable compute‑intensive processing used in broadcast and secure communications equipment.
Unique Advantages
- High logic density: 360,000 logic elements provide a large programmable fabric for complex SoC-level designs and system integration.
- Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM (M20K blocks) reduces external memory dependency and improves data throughput.
- DSP-oriented resources: GS-family variable precision DSP blocks and multiplier support accelerate compute-heavy signal processing without external accelerators.
- Integrated high-speed transceivers: 14.1 Gbps transceivers on GS devices streamline high-bandwidth link implementation for optical and backplane interfaces.
- Industrial operating range: −40 °C to 100 °C rating helps maintain reliable operation in demanding environmental conditions.
- Compact, high‑pin package: 780‑BBGA surface-mount package with 360 I/O supports dense connectivity while minimizing board area.
Why Choose 5SGSMD4E2H29I2N?
The 5SGSMD4E2H29I2N combines the Stratix V GS family’s high logic capacity, sizable on-chip memory, DSP resources, and integrated 14.1 Gbps transceivers in a compact 780‑BBGA package. These characteristics make it well suited for designs that require substantial programmable compute, high I/O density, and robust signal‑processing capability within an industrial temperature envelope.
Choose this FPGA for projects that need scalable logic and memory resources, integrated transceiver links, and the Stratiх V family’s architecture for high-performance, DSP-focused applications. The device’s voltage, thermal, and packaging details support practical system-level integration and long-term deployment in industrial environments.
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