5SGSMD4E2H29I2WN

The 5SGSMD4E2H29I2WN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel designed for high-density programmable logic implementations. It combines substantial logic capacity, on-chip memory, and a large number of I/O to support complex digital designs in industrial-temperature environments.

This device is targeted at applications that require up to approximately 360,000 logic elements, significant embedded memory, and robust operating range—delivered in a 780-ball BGA package for surface-mount systems.

Key Features

• Logic Capacity  Approximately 360,000 logic elements for high-density logic integration and complex design implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O Resources  360 programmable I/O pins to accommodate extensive peripheral and interface connectivity.
• Power Supply  Core supply specified between 870 mV and 930 mV to meet the device's operating requirements.
• Package & Mounting  780-ball BGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for board-level integration.
• Operating Range & Grade  Industrial grade with operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Standards Compliance  RoHS compliant.
• Manufacturer  Intel Stratix V GS family device — electrical and switching characteristics are documented in the Stratix V device datasheet.

Typical Applications

• High-density digital logic  Implement large, complex logic functions and custom hardware accelerators using the device's ~360k logic elements and embedded memory.
• I/O-intensive systems  Support multiple external interfaces and peripherals with 360 I/O pins for flexible board-level connectivity.
• Industrial control & automation  Industrial-grade temperature rating (−40 °C to 100 °C) enables deployment in factory automation, motor control, and process control systems.
• Prototyping and system integration  Large logic and memory resources make this device suitable for consolidating functions and accelerating time-to-prototype in complex designs.

Unique Advantages

• Large programmable capacity: Approximately 360,000 logic elements enable consolidation of multi-function digital designs onto a single device, reducing BOM count.
• Significant on-chip memory: Roughly 19.456 Mbits of embedded RAM provides local storage for buffering, LUTs, and state machines, improving system throughput.
• Extensive I/O count: 360 I/O pins give designers flexibility to interface with a wide range of peripherals without external multiplexing.
• Industrial temperature performance: Rated from −40 °C to 100 °C to support reliable operation in harsh or temperature-variable environments.
• Compact BGA package: 780-ball FCBGA/HBGA packaging supports high-density board layouts and surface-mount assembly processes.
• Regulatory compliance: RoHS compliance supports environmentally responsible manufacturing requirements.

Why Choose 5SGSMD4E2H29I2WN?

The 5SGSMD4E2H29I2WN joins the Stratix V GS family to provide a combination of high logic capacity, substantial embedded memory, and extensive I/O in a surface-mount 780-ball BGA. Its industrial temperature rating and tightly specified core supply range make it suitable for demanding designs where reliability and density matter.

This part is appropriate for engineering teams and system integrators working on complex digital systems that require consolidation of functions, expanded on-chip resources, and robust thermal performance. Backed by Intel’s Stratix V device documentation, the device provides verifiable electrical and switching characteristics for design validation.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGSMD4E2H29I2WN.