5SGSMD4E2H29I3LG

The Intel Stratix V GS device 5SGSMD4E2H29I3LG is a high-density field programmable gate array (FPGA) in a 780‑ball BGA package designed for industrial-grade embedded and communications applications. This device integrates approximately 360,000 logic elements and roughly 19.456 Mbits of on-chip RAM to support complex, high‑capacity digital designs.

With 360 general-purpose I/Os, a surface-mount 780‑BBGA (780‑HBGA, 33×33) package and an industrial operating range, this FPGA is targeted at demanding system designs that require large logic capacity, significant embedded memory and robust thermal tolerance.

Key Features

• Logic Capacity  Approximately 360,000 logic elements to implement large-scale digital functions and custom processing pipelines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for FIFOs, buffers and algorithmic storage.
• I/O Density  360 I/O pins to support wide parallel interfaces, multiple peripherals and board-level connectivity.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to meet the device’s operating requirements.
• Package  780‑BBGA, FCBGA package (supplier device package: 780‑HBGA, 33×33) optimized for high‑density board integration.
• Mounting & Grade  Surface-mount device rated for industrial applications.
• Operating Temperature  –40°C to 100°C for operation across industrial temperature environments.
• Compliance  RoHS‑compliant for environmental and regulatory alignment.

Typical Applications

• Network & Communications Infrastructure  High-density logic and embedded memory allow implementation of packet processing, switching and protocol offload engines.
• Industrial Control & Automation  Industrial temperature grade and wide I/O count support motor control, machine vision interface and real‑time control systems.
• High‑Performance Embedded Systems  Large logic and RAM resources enable custom compute acceleration and hardware-accelerated signal processing.

Unique Advantages

• High Logic Density: 360k logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing system complexity.
• Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and state storage without external memory.
• Extensive I/O: 360 I/Os simplify board design by accommodating numerous parallel interfaces and peripheral connections.
• Industrial‑Grade Thermal Range: Rated from –40°C to 100°C for deployment in temperature‑challenging environments.
• Compact High‑Ball‑Count Package: 780‑BBGA/780‑HBGA (33×33) package enables dense PCB routing and high pin count in a compact footprint.
• Regulatory Compatibility: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGSMD4E2H29I3LG?

The 5SGSMD4E2H29I3LG Stratix V GS FPGA combines large logic capacity, significant embedded memory and a high I/O count in an industrial-grade, surface-mount 780‑BBGA package. These attributes make it suitable for system designs that require on-board compute acceleration, complex protocol handling or dense I/O integration while operating across a wide temperature range.

This device is appropriate for engineering teams building scalable, high‑capacity platforms that value integration and robustness, backed by Intel’s Stratix V device family documentation and specifications.

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