5SGSMD4E2H29I2G

The 5SGSMD4E2H29I2G is an Intel Stratix® V GS-series FPGA supplied in a 780-BBGA (FCBGA) package. This industrial-grade, surface-mount device delivers very large logic capacity, substantial embedded RAM, and a high pin count for designs that require dense programmable logic and extensive I/O.

Designed for applications that demand significant on-chip resources and robust operating range, the device combines 360,000 logic elements with approximately 19.456 Mbits of embedded memory and 360 I/Os, while operating over a core voltage range of 870 mV to 930 mV and a temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  360,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic.
• I/O Density  360 I/O pins to support broad external interfacing and high-pin-count system designs.
• Package & Mounting  780-BBGA (FCBGA) package; supplier package listed as 780-HBGA (33×33). Surface-mount device suitable for modern PCB assembly processes.
• Power and Core Voltage  Core supply range of 870 mV to 930 mV, enabling designs built around low-voltage FPGA cores.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High-density digital processing  Implement complex state machines, datapaths, and custom logic where large logic element counts and embedded RAM are required.
• High-pin-count system interfaces  Use the abundant I/O to connect to multiple peripherals, parallel buses, or complex interconnects in system designs.
• Industrial control and automation  Leverage the industrial temperature rating and robust feature set for factory automation, motor control logic, and machine interface systems.

Unique Advantages

• Substantial programmable resources: 360,000 logic elements and ~19.456 Mbits of embedded RAM reduce the need for external logic and memory, simplifying system BOMs.
• High I/O versatility: 360 I/Os provide flexibility for multi-interface designs and high-bandwidth parallel connections.
• Industrial-grade operation: Specified operation from −40 °C to 100 °C supports deployment in harsher environments without derating logic capabilities.
• Compact high-density package: 780-BBGA / 780-HBGA (33×33) package offers high pin count in a space-efficient form factor for dense PCB layouts.
• Controlled core power envelope: Defined core voltage range (870 mV–930 mV) enables predictable power planning and supply rail design.

Why Choose 5SGSMD4E2H29I2G?

The 5SGSMD4E2H29I2G positions itself for designs that require very large programmable logic capacity, extensive on-chip memory, and a high number of I/Os within an industrial temperature envelope. Its combination of 360,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 360 I/Os makes it suitable for complex, high-density FPGA implementations where integration and I/O bandwidth are key design drivers.

For development teams and procurement looking for a robust Stratix® V GS-series FPGA in a high-pin-count BGA package, this device offers a clear specification set for power, temperature, and mounting that aligns with demanding embedded and industrial applications.

If you would like pricing, availability, or to request a quote for 5SGSMD4E2H29I2G, please submit an inquiry or request a quote through your preferred procurement channel.