5SGSMD4E2H29C3WN

The 5SGSMD4E2H29C3WN is a Stratix V GS Field Programmable Gate Array (FPGA) in a 780-BBGA FCBGA package designed for high-capacity programmable logic applications. This commercial-grade device provides a large logic fabric, substantial embedded memory, and a high I/O count for complex system-level designs.

Key on-chip resources include 360,000 logic elements and approximately 19.456 Mbits of embedded memory, with a supply voltage window of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C. The device is intended for surface-mount board integration and is RoHS compliant.

Key Features

• Core Logic Capacity  Provides 360,000 logic elements to implement large, complex digital designs and custom processing functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive algorithms.
• I/O Density  360 user I/Os to support broad peripheral connectivity and high-pin-count interfaces.
• Power  Specified operating supply voltage range of 820 mV to 880 mV for core power planning and system design.
• Package & Mounting  780-BBGA (FCBGA) package with supplier device package listed as 780-HBGA (33×33); designed for surface-mount PCB assembly.
• Temperature & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant to support environmental and manufacturing requirements.
• Documentation  Device electrical and switching characteristics are covered by the Stratix V device datasheet for detailed design guidance.

Typical Applications

• High-density programmable logic systems  Leverage the 360,000 logic elements to implement large-scale custom logic, accelerators, and state machines.
• Memory-intensive processing  Use the approximately 19.456 Mbits of embedded RAM for data buffering, packet processing, and stream handling.
• I/O-heavy interfaces  Deploy in designs that require large numbers of external connections or parallel interfaces using the 360 I/Os.

Unique Advantages

• High logic and memory integration: Combines 360,000 logic elements with roughly 19.456 Mbits of on-chip RAM to reduce external memory needs and simplify board-level design.
• High I/O count: 360 I/Os provide flexibility to connect diverse peripherals and high-pin-count interfaces without external expander chips.
• Compact surface-mount package: 780-BBGA (FCBGA) package enables dense PCB layouts while maintaining robust electrical performance.
• Commercial temperature grade: Rated 0 °C to 85 °C to match mainstream embedded and communications applications operating in standard environments.
• Regulatory and manufacturing readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGSMD4E2H29C3WN?

The 5SGSMD4E2H29C3WN delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in a surface-mount 780-BBGA package. Its specifications make it suitable for designers targeting high-density programmable logic and memory-heavy applications within commercial temperature environments.

With detailed electrical and switching characteristics available in the Stratix V device documentation and RoHS compliance, this device is positioned for engineers who require scalable on-chip resources, compact board integration, and compliance with common manufacturing standards.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGSMD4E2H29C3WN. Our team can provide lead-time information and support for procurement and design planning.