5SGSMD4E2H29C3N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 447 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E2H29C3N – Stratix® V GS FPGA, 360,000 logic elements, 780-BBGA

The 5SGSMD4E2H29C3N is an Intel Stratix V GS field-programmable gate array in a 780-BBGA FCBGA package designed for DSP-centric, transceiver-enabled applications. Built on a 28‑nm process, this commercial‑grade FPGA combines high logic density, abundant embedded memory, and integrated transceiver and DSP resources for data‑intensive designs.

This device targets applications that require large amounts of on‑chip logic and memory alongside multigigabit transceiver capability and flexible DSP support, delivering a platform for communications, broadcast, and high‑performance compute functions where integration and scalability are important.

Key Features

  • Logic Capacity — 360,000 logic elements, providing substantial fabric resources for complex FPGA designs.
  • Embedded Memory — Approximately 19.456 Mbits of total on‑chip RAM, implemented with 20 Kbit (M20K) memory blocks to support large buffering and dataflow needs.
  • DSP Resources — Abundant variable‑precision DSP blocks in the Stratix V GS family, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑throughput signal processing.
  • Integrated Transceivers — GS family devices include integrated transceivers with up to 14.1 Gbps data‑rate capability for backplane and optical interface applications.
  • Hard IP and Clocking — Embedded HardCopy Block for hardened IP instantiation (including PCIe Gen3/Gen2/Gen1) and fractional PLLs for flexible clock management.
  • Process and Fabric — 28‑nm TSMC technology with adaptive logic modules (ALMs) and multi‑track routing architecture to support dense, high‑performance implementations.
  • I/O and Package — 360 user I/O in a 780‑BBGA (FCBGA) package; supplier package reference 780‑HBGA (33×33). Surface mount mounting type.
  • Power and Operating Range — Core voltage supply range 820 mV to 880 mV; commercial operating temperature range 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Optical and Packet Communications — Use the integrated 14.1 Gbps transceivers and large logic/memory resources for 40G/100G transport, packet processing, and interface bridging.
  • High‑Performance DSP — Leverage the large pool of variable‑precision DSP multipliers and abundant embedded memory for signal processing tasks such as filtering, FFTs, and channel processing.
  • Broadcast and Video Processing — Implement real‑time encoding/decoding, multi‑channel processing, and formatting with on‑chip RAM and DSP blocks to meet throughput and latency demands.
  • Network Test and Measurement — Combine high logic density and multigigabit transceivers for instrumentation, test systems, and traffic management platforms.

Unique Advantages

  • Large Logic Fabric: 360,000 logic elements allow complex system functions and extensive custom logic to be implemented on a single device, reducing BOM and board area.
  • Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM provides local buffering and data storage for high‑bandwidth streaming and low‑latency processing.
  • DSP‑Centric Architecture: Support for thousands of 18×18 and 27×27 multipliers enables high‑precision, high‑throughput signal processing without external accelerators.
  • Integrated High‑Speed I/O: On‑die transceivers rated up to 14.1 Gbps simplify high‑speed link design for optical and backplane interfaces.
  • Hardened IP and Clocking: Embedded HardCopy Block and fractional PLLs facilitate proven protocol instantiation (PCIe Gen3/Gen2/Gen1) and flexible timing architectures.
  • Commercial Temperature and RoHS Compliance: Designed for commercial applications with a 0 °C to 85 °C operating range and RoHS‑compliant manufacturing.

Why Choose 5SGSMD4E2H29C3N?

The 5SGSMD4E2H29C3N positions itself as a high‑capacity, DSP‑focused Stratix V GS FPGA that balances dense logic, significant embedded memory, and multigigabit transceiver capability in a 780‑ball BGA package. Its 28‑nm process architecture, extensive DSP multipliers, and hardened IP options make it suitable for designers targeting transceiver‑based, data‑intensive systems where on‑chip integration reduces system complexity.

This device is well suited for teams developing communications, broadcast, and high‑performance compute applications who need a commercially rated FPGA with scalable resources and an established ecosystem for IP and design flow support.

Request a quote or submit a procurement inquiry to receive pricing and availability details for the 5SGSMD4E2H29C3N.

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