5SGSMD4E2H29C2WN

The 5SGSMD4E2H29C2WN is an Intel Stratix V GS series field programmable gate array supplied in a 780-BBGA (FCBGA) package. It provides a large on-chip programmable logic capacity and substantial embedded memory with a commercial temperature rating for board- and system-level designs.

Key attributes include 360,000 logic elements, approximately 19.456 Mbits of embedded memory, 360 device I/Os, surface-mount 780-HBGA (33 × 33) packaging, and a documented operating core voltage range of 870 mV to 930 mV.

Key Features

• Core Logic  360,000 logic elements for extensive programmable logic and complex function implementation.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage.
• I/O Capacity  360 device I/Os to support dense board-level interfaces and multi-channel connectivity.
• Power and Voltage  Core supply specified from 870 mV to 930 mV, enabling defined power planning for the FPGA core.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for standard PCB assembly.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.
• Documentation  Electrical and switching characteristics, I/O timing, and operating conditions are documented in the Stratix V device datasheet.

Typical Applications

• High-density digital processing  Large logic capacity and embedded RAM enable implementation of complex digital engines and custom datapaths.
• Board-level system integration  High I/O count supports dense peripheral and interface routing on multi-function PCBs.
• Memory-intensive logic  On-chip RAM capacity suits designs requiring local buffering, FIFOs, or packet/queue storage.

Unique Advantages

• Large programmable logic capacity: 360,000 logic elements provide room for sizable custom logic and parallel processing blocks.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many functions.
• High I/O density: 360 I/Os allow flexible interface options and support for multiple peripherals or channels.
• Defined core voltage range: 870–930 mV core supply enables precise power design and budgeting for the FPGA core.
• Robust packaging for high-pin-count designs: 780-BBGA (33×33) surface-mount package supports dense signal routing while maintaining a compact board footprint.
• Commercial temperature rating: 0 °C to 85 °C operation aligns with many mainstream electronic product environments.

Why Choose 5SGSMD4E2H29C2WN?

The 5SGSMD4E2H29C2WN delivers a combination of high logic capacity, sizable embedded memory, and a large I/O complement in a 780-BBGA surface-mount package. Its specified core voltage range and commercial operating temperature make it suitable for complex digital systems where integration density and on-chip resources are important considerations.

This part is appropriate for development teams and OEMs designing systems that require substantial programmable logic, local RAM, and a high number of I/Os while relying on documented electrical and switching characteristics provided in the Stratix V device documentation.

Request a quote or submit an inquiry to receive pricing, lead-time, and ordering information for 5SGSMD4E2H29C2WN. Technical documentation is available in the Stratix V device datasheet for detailed electrical and timing specifications.