5SGSMD4E2H29C2LG

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 997 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E2H29C2LG – Stratix® V GS FPGA, 360,000 Logic Elements, 360 I/Os, 780‑BBGA

The 5SGSMD4E2H29C2LG is a Stratix V GS family field programmable gate array (FPGA) optimized for high-density logic and embedded memory integration. This commercial‑grade FPGA combines a large logic fabric with substantial on‑chip RAM and extensive I/O to address complex system designs that require scalable programmable logic.

Key device characteristics include 360,000 logic elements, approximately 19.456 Mbits of embedded memory, 360 I/Os, and a 780‑ball BGA (FCBGA) package. The device operates over a core supply range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic 360,000 logic elements provide a high-capacity programmable fabric for large-scale logic integration and complex algorithm implementation.
  • Embedded Memory Approximately 19.456 Mbits of on‑chip RAM for buffering, packet processing, and data‑path storage without immediate reliance on external memory.
  • I/O Density 360 general-purpose I/Os to support dense board‑level connectivity and multiple parallel interfaces.
  • Power and Voltage Core supply voltage specified from 820 mV to 880 mV, enabling predictable power provisioning for the device core.
  • Package 780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33) to support compact, high‑pin‑count designs.
  • Operating Grade and Temperature Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
  • Standards and Compliance RoHS compliant to meet common environmental and regulatory requirements for electronic components.

Typical Applications

  • High‑density digital processing — Use the large logic element count for complex signal processing, algorithm acceleration, and data path consolidation.
  • Multi‑port I/O systems — Leverage 360 I/Os for interfacing multiple parallel buses, sensors, or peripheral subsystems on a single device.
  • On‑chip buffering and memory‑centric designs — Approximately 19.456 Mbits of embedded RAM supports packet buffering, FIFO structures, and temporary data storage.
  • High‑speed serial and transceiver‑based designs — Stratix V GS family devices include documented transceiver and I/O timing capabilities suitable for multi‑Gbps channel designs as detailed in the device datasheet.

Unique Advantages

  • High logic capacity: 360,000 logic elements enable consolidation of multiple functions into a single FPGA, simplifying system architecture.
  • Significant embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and packet processing tasks.
  • Extensive I/O: 360 I/Os provide flexibility for dense connectivity and multiple simultaneous interfaces without additional I/O expanders.
  • Compact high‑pin package: The 780‑BBGA FCBGA package supports high‑pin counts in a compact footprint for board space‑constrained designs.
  • Commercial availability and compliance: Commercial grade rating (0 °C to 85 °C) and RoHS compliance simplify procurement and regulatory alignment for standard commercial products.

Why Choose 5SGSMD4E2H29C2LG?

The 5SGSMD4E2H29C2LG positions itself as a high‑capacity Stratix V GS FPGA for designs that demand dense logic, substantial on‑chip RAM, and broad I/O support in a compact BGA package. Its commercial grade rating, documented electrical characteristics, and family datasheet support make it suitable for engineers building complex digital systems where integration and predictable operating conditions matter.

This device is well suited for teams developing advanced digital signal processing, high‑throughput data paths, and multi‑interface platforms that benefit from a single, scalable FPGA solution backed by the Stratix V device documentation.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGSMD4E2H29C2LG.

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