5SGSMD4E1H29I2WN

The 5SGSMD4E1H29I2WN is an Intel Stratix V GS Field Programmable Gate Array (FPGA) IC supplied in a 780‑BBGA FCBGA package. It delivers large programmable logic capacity and a high I/O count in an industrial‑grade device.

Designed for systems that require high-density programmable logic and robust operating conditions, this device provides a combination of core resources, on‑chip memory, and wide operating temperature range suitable for industrial deployments.

Key Features

• Logic Capacity  360,000 logic elements provide extensive programmable logic resources for complex designs.
• On‑Chip Memory  Approximately 19.46 Mbits of embedded RAM for buffering, state storage, and data manipulation on chip.
• I/O Resources  360 user I/O pins to support dense interface and connectivity requirements.
• Power and Voltage  Core supply voltage range of 870 mV to 930 mV to accommodate low‑voltage power architectures.
• Package and Mounting  780‑BBGA FCBGA package (supplier device package: 780‑HBGA, 33×33) with surface‑mount mounting for high‑density PCB integration.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial embedded systems  Industrial‑grade temperature range and high logic capacity make this device suitable for industrial control, automation, and processing nodes that require robust operation.
• High‑density programmable logic systems  Large logic element count and substantial on‑chip RAM support complex state machines, data processing pipelines, and custom accelerators.
• Complex I/O aggregation  360 I/O pins enable aggregation and routing of multiple interfaces and signals in compact board layouts.

Unique Advantages

• High programmable capacity: 360,000 logic elements reduce the need for multi‑device solutions by consolidating large designs into a single FPGA.
• Significant embedded memory: Approximately 19.46 Mbits of on‑chip RAM supports buffering and local data storage without external memory.
• Extensive I/O availability: 360 I/Os enable integration of multiple peripherals and parallel interfaces directly to the FPGA.
• Industrial reliability: Rated for −40 °C to 100 °C operation, suitable for sustained use in harsh or variable temperature environments.
• High‑density package: 780‑BBGA (780‑HBGA 33×33) surface‑mount package provides a compact solution for high‑pin‑count designs.
• Low core voltage operating window: 870–930 mV core supply supports efficient power design and modern low‑voltage systems.

Why Choose 5SGSMD4E1H29I2WN?

The 5SGSMD4E1H29I2WN brings Intel Stratix V GS class resources—large logic capacity, substantial embedded RAM, and a high I/O count—into an industrial‑grade, surface‑mount 780‑BBGA package. It is positioned for designs that require consolidated programmable logic, significant on‑chip storage, and reliable operation across a wide temperature range.

This device is appropriate for engineers and integrators building complex programmable systems that need scalability, high I/O density, and industrial operating capability, backed by Intel's Stratix V device family documentation and product support.

Request a quote or submit a pricing and availability request for 5SGSMD4E1H29I2WN to evaluate this device for your next high‑density, industrial FPGA design.