5SGSMD4E1H29C2N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 1,433 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E1H29C2N – Stratix® V GS FPGA, 360,000 logic elements, 780-BBGA

The 5SGSMD4E1H29C2N is a Stratix® V GS field programmable gate array (FPGA) device built on a 28-nm process. It combines a high-density logic fabric with abundant embedded memory and DSP resources targeted at transceiver-based, DSP-centric applications.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and integrated transceiver capability, this device is positioned for bandwidth- and compute-intensive use cases such as packet processing, optical transport, and high-performance signal processing.

Key Features

  • Logic Capacity — 360,000 logic elements for complex custom logic and control implementation.
  • Embedded Memory — Approximately 19.456 Mbits of on-chip RAM provided by 20-Kbit (M20K) memory blocks for buffering, packet queues, and large local data storage.
  • DSP Resources — Variable precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision digital signal processing.
  • Integrated Transceivers — GS variant transceivers with up to 14.1 Gbps data-rate capability suitable for backplane and optical interface applications.
  • I/O and Package — 360 user I/Os in a 780-BBGA (FCBGA) footprint; supplier device package listed as 780-HBGA (33×33), surface-mount mounting.
  • Core and Power — 28-nm core architecture with a specified supply range of 870 mV to 930 mV.
  • Clocking and Integration — Fractional PLLs and a comprehensive fabric clocking network for synchronized, multi-channel designs.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C.

Typical Applications

  • Optical and Backplane Transport — Use the integrated 14.1-Gbps transceivers and high logic capacity to implement line cards, serializers/deserializers, and protocol handling for 40G/100G systems.
  • High-Performance DSP — Leverage the large complement of variable-precision DSP blocks and embedded memory for filtering, FFTs, and other signal-processing pipelines.
  • Packet Processing and Networking — Implement packet parsing, queuing, and traffic management functions using the plentiful logic elements and on-chip RAM.
  • Broadcast and Military Communications — Deploy transceiver-enabled DSP-centric functions for modulation, demodulation, and channel processing within the commercial temperature range.

Unique Advantages

  • High Logic Density: 360,000 logic elements enable complex system logic and deep pipeline architectures without external logic expansion.
  • Substantial On-Chip Memory: Approximately 19.456 Mbits of embedded RAM reduce dependency on external memory for buffering and local data storage.
  • DSP-Centric Resources: Thousands of dedicated multipliers support high-precision and high-throughput signal-processing implementations.
  • Transceiver Integration: GS-class 14.1-Gbps transceivers provide native support for high-speed backplane and optical interfaces.
  • Production Pathway: Stratix V devices support prototyping and migration to HardCopy® V ASICs for higher-volume production scenarios.
  • Compact, Surface-Mount Packaging: 780-BBGA (33×33) package with 360 I/Os balances I/O density and board-level integration for system designs.

Why Choose 5SGSMD4E1H29C2N?

The 5SGSMD4E1H29C2N delivers a balanced combination of logic capacity, embedded memory, dedicated DSP resources, and high-speed transceiver capability in a single Stratix V GS device. It is suitable for designers who need substantial on-chip resources to implement compute- and bandwidth-intensive functions within a commercial temperature range.

For teams targeting transceiver-based DSP applications, packet processing, or optical transport designs, this device provides a viable prototyping platform with a clear production migration path to HardCopy V ASICs, helping manage long-term design and manufacturing considerations.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the 5SGSMD4E1H29C2N.

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