5SGSMD4E1H29C2N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,433 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4E1H29C2N – Stratix® V GS FPGA, 360,000 logic elements, 780-BBGA
The 5SGSMD4E1H29C2N is a Stratix® V GS field programmable gate array (FPGA) device built on a 28-nm process. It combines a high-density logic fabric with abundant embedded memory and DSP resources targeted at transceiver-based, DSP-centric applications.
With 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and integrated transceiver capability, this device is positioned for bandwidth- and compute-intensive use cases such as packet processing, optical transport, and high-performance signal processing.
Key Features
- Logic Capacity — 360,000 logic elements for complex custom logic and control implementation.
- Embedded Memory — Approximately 19.456 Mbits of on-chip RAM provided by 20-Kbit (M20K) memory blocks for buffering, packet queues, and large local data storage.
- DSP Resources — Variable precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision digital signal processing.
- Integrated Transceivers — GS variant transceivers with up to 14.1 Gbps data-rate capability suitable for backplane and optical interface applications.
- I/O and Package — 360 user I/Os in a 780-BBGA (FCBGA) footprint; supplier device package listed as 780-HBGA (33×33), surface-mount mounting.
- Core and Power — 28-nm core architecture with a specified supply range of 870 mV to 930 mV.
- Clocking and Integration — Fractional PLLs and a comprehensive fabric clocking network for synchronized, multi-channel designs.
- Operating Range — Commercial grade operation from 0 °C to 85 °C.
Typical Applications
- Optical and Backplane Transport — Use the integrated 14.1-Gbps transceivers and high logic capacity to implement line cards, serializers/deserializers, and protocol handling for 40G/100G systems.
- High-Performance DSP — Leverage the large complement of variable-precision DSP blocks and embedded memory for filtering, FFTs, and other signal-processing pipelines.
- Packet Processing and Networking — Implement packet parsing, queuing, and traffic management functions using the plentiful logic elements and on-chip RAM.
- Broadcast and Military Communications — Deploy transceiver-enabled DSP-centric functions for modulation, demodulation, and channel processing within the commercial temperature range.
Unique Advantages
- High Logic Density: 360,000 logic elements enable complex system logic and deep pipeline architectures without external logic expansion.
- Substantial On-Chip Memory: Approximately 19.456 Mbits of embedded RAM reduce dependency on external memory for buffering and local data storage.
- DSP-Centric Resources: Thousands of dedicated multipliers support high-precision and high-throughput signal-processing implementations.
- Transceiver Integration: GS-class 14.1-Gbps transceivers provide native support for high-speed backplane and optical interfaces.
- Production Pathway: Stratix V devices support prototyping and migration to HardCopy® V ASICs for higher-volume production scenarios.
- Compact, Surface-Mount Packaging: 780-BBGA (33×33) package with 360 I/Os balances I/O density and board-level integration for system designs.
Why Choose 5SGSMD4E1H29C2N?
The 5SGSMD4E1H29C2N delivers a balanced combination of logic capacity, embedded memory, dedicated DSP resources, and high-speed transceiver capability in a single Stratix V GS device. It is suitable for designers who need substantial on-chip resources to implement compute- and bandwidth-intensive functions within a commercial temperature range.
For teams targeting transceiver-based DSP applications, packet processing, or optical transport designs, this device provides a viable prototyping platform with a clear production migration path to HardCopy V ASICs, helping manage long-term design and manufacturing considerations.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the 5SGSMD4E1H29C2N.

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