5SGSMD4E1H29C2L
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA |
|---|---|
| Quantity | 548 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4E1H29C2L – Stratix V GS FPGA, 360,000 Logic Elements, 780-BBGA
The 5SGSMD4E1H29C2L is a Stratix® V GS field-programmable gate array (FPGA) in a 780-BBGA (33×33) FCBGA package. Based on Stratix V family architecture, this GS device is positioned for DSP-centric and transceiver-enabled applications that require large logic capacity, substantial embedded memory, and high I/O count.
With 360,000 logic elements, approximately 19.456 Mbits of on-chip RAM and support for integrated transceivers and variable-precision DSP blocks (as provided for Stratix V GS devices), this FPGA targets high-performance communications, signal processing and compute-dense designs while offering a defined commercial operating range.
Key Features
- Core and Process Stratix V family architecture built on a 28‑nm process technology; the product-specific core supply operates in the 820 mV to 880 mV range.
- Logic Capacity 360,000 logic elements suitable for large-scale logic integration and complex system functions.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM provided for buffering, packet processing and local data storage.
- DSP and Math Resources GS-class devices include an abundance of variable‑precision DSP blocks (family-level feature) to accelerate high-precision digital signal processing workloads.
- Transceiver Capability Stratix V GS devices provide integrated transceivers with 14.1‑Gbps data-rate capability (family-level feature) for backplane and optical interfaces.
- I/O and Packaging 360 general-purpose I/Os in a 780‑BBGA (FCBGA, 33×33) surface‑mount package for dense board-level integration.
- System Fabric and Clocking Family-level architecture includes multi-track routing, adaptive logic modules and fractional PLLs to support complex clocking and high-performance interconnect.
- Operating Conditions Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High-performance DSP systems Use the device’s variable-precision DSP blocks and large logic capacity for signal processing in broadcast, wireline and compute-intensive applications.
- Optical and high-speed networking Integrated transceiver capability and abundant on-chip memory make it suitable for 40G/100G transport, backplane interfaces and packet processing.
- Network test and traffic management High logic density and I/O count support complex packet-handling, monitoring and traffic-management functions.
- Prototyping for volume ASIC conversion Prototype production designs on Stratix V GS devices and leverage the documented low-risk, low-cost path to HardCopy® V ASICs for higher-volume deployment.
Unique Advantages
- Large programmable fabric: 360,000 logic elements provide headroom for complex system implementations and multi-function designs.
- Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces external memory dependency for buffering and real-time data paths.
- DSP-optimized family features: Variable-precision DSP blocks in the Stratix V GS family accelerate arithmetic- and filter-heavy workloads without external accelerators.
- High I/O density in compact package: 360 I/Os in a 780‑BBGA footprint enable dense board routing and multiple high-speed interfaces.
- Defined commercial operating range: Commercial-grade operating temperature (0 °C to 85 °C) and RoHS compliance support mainstream electronics manufacturing requirements.
- Path to ASIC production: Stratix V family supports prototyping and a documented conversion path to HardCopy V ASICs for cost and unit-volume optimization.
Why Choose 5SGSMD4E1H29C2L?
The 5SGSMD4E1H29C2L delivers a combination of large logic capacity, significant embedded memory and GS-class DSP/transceiver family features in a 780‑BBGA package—making it a practical choice for designers of communications, signal-processing and high-throughput systems. Its commercial-grade specification and RoHS compliance fit mainstream product and prototype workflows.
Choose this Stratix V GS device when your design requires high logic density, extensive on-chip RAM and family-level DSP and transceiver capabilities, with a supported upgrade path to HardCopy V ASICs for higher-volume production.
Request a quote or submit an inquiry to receive pricing and availability for part 5SGSMD4E1H29C2L.

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