5SGSMD4E1H29C2L

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 548 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E1H29C2L – Stratix V GS FPGA, 360,000 Logic Elements, 780-BBGA

The 5SGSMD4E1H29C2L is a Stratix® V GS field-programmable gate array (FPGA) in a 780-BBGA (33×33) FCBGA package. Based on Stratix V family architecture, this GS device is positioned for DSP-centric and transceiver-enabled applications that require large logic capacity, substantial embedded memory, and high I/O count.

With 360,000 logic elements, approximately 19.456 Mbits of on-chip RAM and support for integrated transceivers and variable-precision DSP blocks (as provided for Stratix V GS devices), this FPGA targets high-performance communications, signal processing and compute-dense designs while offering a defined commercial operating range.

Key Features

  • Core and Process  Stratix V family architecture built on a 28‑nm process technology; the product-specific core supply operates in the 820 mV to 880 mV range.
  • Logic Capacity  360,000 logic elements suitable for large-scale logic integration and complex system functions.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM provided for buffering, packet processing and local data storage.
  • DSP and Math Resources  GS-class devices include an abundance of variable‑precision DSP blocks (family-level feature) to accelerate high-precision digital signal processing workloads.
  • Transceiver Capability  Stratix V GS devices provide integrated transceivers with 14.1‑Gbps data-rate capability (family-level feature) for backplane and optical interfaces.
  • I/O and Packaging  360 general-purpose I/Os in a 780‑BBGA (FCBGA, 33×33) surface‑mount package for dense board-level integration.
  • System Fabric and Clocking  Family-level architecture includes multi-track routing, adaptive logic modules and fractional PLLs to support complex clocking and high-performance interconnect.
  • Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High-performance DSP systems  Use the device’s variable-precision DSP blocks and large logic capacity for signal processing in broadcast, wireline and compute-intensive applications.
  • Optical and high-speed networking  Integrated transceiver capability and abundant on-chip memory make it suitable for 40G/100G transport, backplane interfaces and packet processing.
  • Network test and traffic management  High logic density and I/O count support complex packet-handling, monitoring and traffic-management functions.
  • Prototyping for volume ASIC conversion  Prototype production designs on Stratix V GS devices and leverage the documented low-risk, low-cost path to HardCopy® V ASICs for higher-volume deployment.

Unique Advantages

  • Large programmable fabric: 360,000 logic elements provide headroom for complex system implementations and multi-function designs.
  • Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces external memory dependency for buffering and real-time data paths.
  • DSP-optimized family features: Variable-precision DSP blocks in the Stratix V GS family accelerate arithmetic- and filter-heavy workloads without external accelerators.
  • High I/O density in compact package: 360 I/Os in a 780‑BBGA footprint enable dense board routing and multiple high-speed interfaces.
  • Defined commercial operating range: Commercial-grade operating temperature (0 °C to 85 °C) and RoHS compliance support mainstream electronics manufacturing requirements.
  • Path to ASIC production: Stratix V family supports prototyping and a documented conversion path to HardCopy V ASICs for cost and unit-volume optimization.

Why Choose 5SGSMD4E1H29C2L?

The 5SGSMD4E1H29C2L delivers a combination of large logic capacity, significant embedded memory and GS-class DSP/transceiver family features in a 780‑BBGA package—making it a practical choice for designers of communications, signal-processing and high-throughput systems. Its commercial-grade specification and RoHS compliance fit mainstream product and prototype workflows.

Choose this Stratix V GS device when your design requires high logic density, extensive on-chip RAM and family-level DSP and transceiver capabilities, with a supported upgrade path to HardCopy V ASICs for higher-volume production.

Request a quote or submit an inquiry to receive pricing and availability for part 5SGSMD4E1H29C2L.

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