5SGSMD4E1H29C2G

The 5SGSMD4E1H29C2G is a Stratix V GS family FPGA in a 780-BBGA (FCBGA) package designed for high-density programmable logic applications. It delivers a large pool of logic elements, substantial on-chip RAM, and extensive I/O to support complex, highly parallel designs.

This commercial-grade FPGA targets designs that require extensive programmable logic capacity, significant embedded memory, and a broad I/O complement, while operating within standard commercial temperature and low-voltage core supply ranges.

Key Features

• Logic Capacity  360,000 logic elements for implementing large digital designs and deep logic networks.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
• I/O Resources  360 user I/O pins to accommodate wide external interfaces and parallel data paths.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for standard PCB assembly.
• Power  Core voltage supply range of 870 mV to 930 mV, enabling operation within a defined low-voltage core window.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital designs  Implement complex custom logic, state machines, and data-path pipelines that demand large logic element counts and on-chip memory.
• Data buffering and packet processing  Use the substantial embedded RAM and abundant I/O to handle buffering, queuing, and parallel packet manipulation tasks.
• Prototyping and system integration  Leverage the device’s programmable fabric and high I/O count for system prototyping or integration of custom peripherals and interfaces.

Unique Advantages

• High logic density: 360,000 logic elements provide ample capacity for complex implementations without immediate device scaling.
• Significant on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage needs.
• Extensive I/O: 360 I/O pins simplify connection to wide buses, multiple peripherals, and parallel interfaces.
• Compact, surface-mount package: 780-BBGA/780-HBGA footprint supports high-pin-count routing in a compact form factor suited for dense PCBs.
• Commercial temperature grade: Rated 0 °C to 85 °C for standard commercial applications and deployments.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGSMD4E1H29C2G?

The 5SGSMD4E1H29C2G combines high logic element capacity, substantial embedded memory, and a large I/O complement in a compact 780-pin BGA package, making it well suited for designers who need significant on-chip resources in commercial-grade systems. Its defined core voltage range and RoHS compliance provide predictable integration parameters for production designs.

This device is a practical choice for engineers developing complex digital systems that require scalable FPGA fabric, on-chip storage, and plentiful external connectivity while operating within standard commercial temperature limits.

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