5SGSMD3H3F35I4N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 278 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H3F35I4N – Stratix® V GS FPGA, 1152‑FBGA (35×35)

The 5SGSMD3H3F35I4N is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1152‑BBGA FCBGA package. It delivers large on‑chip logic and memory resources with a high I/O count and is provided in an industrial temperature grade.

Designed for applications that require substantial programmable logic, embedded memory, and a wide operating temperature range, this device combines 236,000 logic elements, approximately 13.3 Mbits of embedded RAM, and 432 I/Os to support complex custom designs.

Key Features

  • Core Logic — 236,000 logic elements provide extensive capacity for custom digital logic, control, and processing functions.
  • Logic Array Blocks (LABs) — 89,000 LABs (logic array blocks) for structured logic implementation and resource allocation.
  • Embedded Memory — Approximately 13.3 Mbits of on‑chip RAM for buffering, lookup tables, and local storage.
  • I/O Density — 432 device I/Os to support dense peripheral and interface requirements.
  • Power Supply — Core voltage range of 820 mV to 880 mV to match system power domains.
  • Package — 1152‑BBGA (FCBGA), supplier device package 1152‑FBGA (35×35), suitable for compact, high‑pin‑count board designs.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable operation in thermally demanding environments.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Control and Automation — Large logic capacity and industrial temperature rating enable custom control, sequencing, and real‑time processing functions.
  • Communications and Networking — High I/O count and abundant on‑chip memory support protocol handling, packet processing, and interface bridging.
  • Signal Processing and Data Acquisition — Significant logic and embedded RAM resources facilitate streaming data buffering, preprocessing, and custom DSP pipelines.
  • High‑Density Custom Logic — Suitable for applications requiring complex, tightly integrated programmable logic and multiple external interfaces.

Unique Advantages

  • Substantial Logic Capacity: 236,000 logic elements enable large, multi‑function designs without immediate migration to larger devices.
  • Generous Embedded Memory: Approximately 13.3 Mbits of RAM reduces dependence on external memory for many buffering and table lookup tasks.
  • High I/O Count: 432 I/Os provide flexibility to connect multiple peripherals, high‑speed interfaces, and board‑level signals.
  • Industrial Reliability: Rated from −40 °C to 100 °C to withstand demanding environmental conditions common in industrial deployments.
  • Compact High‑Pin Package: 1152‑FBGA (35×35) packaging supports dense board integration while providing the required pin count for complex systems.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious design and manufacturing requirements.

Why Choose 5SGSMD3H3F35I4N?

The 5SGSMD3H3F35I4N positions itself as a high‑capacity, industrial‑grade Stratix V GS FPGA that balances large programmable logic, substantial on‑chip memory, and a high I/O count in a compact 1152‑FBGA footprint. Its specified core voltage range and extended operating temperature make it suitable for designs that require dependable operation across varied thermal conditions.

This device is appropriate for engineers and system designers building complex, custom digital systems—where integration density, significant local memory, and wide I/O flexibility drive system architecture decisions. RoHS compliance and industrial temperature rating further support long‑term deployment considerations.

Request a quote or submit a product inquiry to evaluate the 5SGSMD3H3F35I4N for your next design or procurement decision.

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