5SGSMD3H2F35C2L

The 5SGSMD3H2F35C2L is an Intel Stratix V GS field-programmable gate array (FPGA) in a 1152-ball FCBGA (35×35) package. It combines a high-density programmable fabric with the Stratix V family’s advanced core architecture and integrated hard IP elements.

Designed for bandwidth- and DSP-centric systems, this device targets applications that require large logic capacity, substantial on-chip memory, and extensive I/O while operating at a commercial temperature range and low core voltage.

Key Features

• Programmable Logic Capacity — 236,000 logic elements providing significant programmable resources for complex designs.
• Embedded Memory — Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) for high-density buffering and data storage.
• I/O Density — 432 I/O pins to support wide bus interfaces and diverse peripheral connections.
• DSP and Transceiver Capabilities — As a Stratix V GS device, the family provides abundant variable-precision DSP blocks and integrated transceivers with 14.1-Gbps capability; the Stratix V family also includes options for transceivers up to 28.05 Gbps.
• Advanced FPGA Architecture — Family-level features include a redesigned adaptive logic module (ALM), M20K embedded memory blocks, fractional PLLs, and an enhanced multi-track routing fabric for predictable timing and high performance.
• Embedded Hard IP — Includes Embedded HardCopy Block functionality for hardening common IP such as PCIe Gen3/Gen2/Gen1 (family-level capability).
• Package — 1152-FBGA (35×35) FCBGA package for compact, high-pin-count board implementations.
• Power and Temperature — Core supply range 820 mV to 880 mV and commercial operating temperature 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑bandwidth Networking — Packet processing, switching and line cards where large logic capacity and many I/O are used to implement data-paths and protocol handling.
• Optical and Backplane Interfaces — Transceiver-capable Stratix V GS devices suited for 40G/100G optical transport and backplane interfaces.
• DSP‑Centric Systems — Broadcast, military, and high-performance computing applications that leverage variable-precision DSP blocks for signal processing workloads.
• PCI Express Systems — Bandwidth-centric applications and protocols, including implementation of PCIe Gen3 interfaces using the family’s embedded hard IP options.

Unique Advantages

• High Logic Density: 236,000 logic elements enable complex control, data-path, and custom processing implementations without external ASICs.
• Substantial On‑Chip Memory: Approximately 13.3 Mbits of embedded RAM reduces external memory dependencies and supports large buffering and packet queues.
• Extensive I/O Count: 432 I/Os provide flexibility for parallel interfaces, multi-lane transceivers, and high-pin-count designs.
• Family-Level High-Speed Transceivers: Stratix V family transceiver options (including 14.1-Gbps capability on GS devices) support high-throughput serial protocols common in networking and transport systems.
• Low Core Voltage Operation: Supported core supply range of 820–880 mV aligns with low-voltage, power-conscious system designs.
• Packaged for Dense Designs: 1152-FBGA (35×35) package balances pin count and board-area efficiency for compact system implementations.

Why Choose 5SGSMD3H2F35C2L?

The 5SGSMD3H2F35C2L delivers a balance of large programmable logic resources, significant embedded memory, and a high I/O count in a commercial-grade Stratix V GS device. It is suited for engineers building bandwidth- and DSP-oriented systems that benefit from the Stratix V family’s architectural features—such as adaptive logic modules, M20K memory blocks, and embedded hard IP for common protocols.

This device is appropriate for designs that require scalability, plentiful on-chip resources, and family-level transceiver/DSP capabilities, backed by Intel’s Stratix V architecture and documentation.

Request a quote or submit your inquiry for pricing and availability to move your design forward with the 5SGSMD3H2F35C2L.