5SGSMD3H2F35C1N

The 5SGSMD3H2F35C1N is a Stratix V GS field-programmable gate array delivered in a 1152-BBGA (35×35) surface-mount package. It combines a high logic element count, substantial on-chip embedded memory, and transceiver-enabled DSP capability targeted at bandwidth- and DSP-centric applications.

This device suits data-intensive designs that require large programmable logic capacity, variable-precision DSP resources, and a high pin-count I/O footprint within a commercial-grade operating range.

Key Features

• Core & Process  28-nm TSMC process technology with a core supply voltage in the 870 mV to 930 mV range, supporting the device’s high-performance fabric and hard IP blocks.
• Logic Capacity  236,000 logic elements to implement complex custom logic and system functions.
• Embedded Memory  Approximately 13.312 Mbits of on-chip RAM (total RAM bits: 13,312,000) for buffering, packet storage, and intermediate data processing.
• DSP & Transceivers (GS variant)  GS family devices include abundant variable-precision DSP blocks and integrated transceivers supporting 14.1‑Gbps data rates, optimized for transceiver-based DSP applications.
• I/O & Packaging  432 general-purpose I/Os in a 1152-FBGA (35×35) FCBGA package, delivered as a surface-mount component for high-density board implementations.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard production environments.
• Production Path  Part of the Stratix V family, which supports a low-risk path to HardCopy V ASICs for higher-volume production (series-level capability).

Typical Applications

• High-performance DSP systems  Leverage the GS variant’s variable-precision DSP blocks and embedded memory for signal processing, filtering, and algorithm acceleration.
• Optical and backplane transport  Integrated transceivers and large logic capacity enable 40G/100G-class transport and packet processing applications.
• Broadcast and media processing  Combine dense logic, on-chip RAM, and DSP resources to implement video processing pipelines and real-time encoding/decoding functions.
• Network and wireline equipment  Use the device for traffic management, protocol processing, and bandwidth-centric interfaces requiring flexible, high-density logic.

Unique Advantages

• High logic density: 236,000 logic elements provide headroom for complex control, datapath, and protocol implementations without external glue logic.
• Substantial embedded memory: Approximately 13.312 Mbits of on-chip RAM reduces external memory dependency for buffering and packet staging.
• DSP-optimized GS variant: Variable-precision DSP blocks and GS transceiver capabilities support compute-heavy, transceiver-based signal processing tasks.
• Robust I/O and package footprint: 432 I/Os in a 1152-FBGA (35×35) FCBGA surface-mount package enables dense board routing and a high number of external interfaces.
• Commercial operating range and compliance: 0 °C to 85 °C operating range and RoHS compliance for standard commercial deployments.
• Scalable production path: Part of the Stratix V family offering a defined route to HardCopy V ASICs for volume production planning.

Why Choose 5SGSMD3H2F35C1N?

The 5SGSMD3H2F35C1N positions itself as a processor-class FPGA for designers who need a balance of large programmable logic, ample embedded memory, and transceiver-enabled DSP capability in a commercial-grade package. Its combination of 236,000 logic elements, approximately 13.312 Mbits of on-chip RAM, and 432 I/Os makes it suitable for high-throughput, data- and signal-intensive applications.

Engineers and procurement teams will find this device appropriate for designs that require scalable prototyping with an established production path within the Stratix V family, while retaining flexibility for complex algorithm implementation and high-bandwidth interfacing.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the 5SGSMD3H2F35C1N.