5SGSMD3H1F35I2N

The 5SGSMD3H1F35I2N is an Intel Stratix V GS field-programmable gate array (FPGA) in a 1152‑ball FCBGA package. Built on the Stratix V family architecture, it combines a high logic capacity with abundant embedded memory and DSP resources for transceiver‑based, DSP‑centric applications.

Targeted at data‑intensive and bandwidth‑centric designs, this GS variant delivers integrated transceivers, variable‑precision DSP capabilities, and a path to HardCopy V ASICs for higher‑volume production.

Key Features

• Core Architecture Stratix V family architecture implemented in the GS variant for DSP‑centric and transceiver‑enabled designs.
• Logic Capacity Approximately 236,000 logic elements for large FPGA designs and complex system integration.
• Embedded Memory Approximately 13.3 Mbits of on‑chip RAM (13,312,000 bits) using the family’s M20K memory blocks.
• Variable‑Precision DSP GS devices support high counts of variable precision DSP multipliers (up to 3,926 18×18 or 1,963 27×27 multipliers as provided for the GS family).
• High‑Speed Transceivers Integrated transceivers with 14.1‑Gbps data‑rate capability in the GS variant for backplane and optical interfaces.
• I/O and Package 432 I/Os in a 1152‑BBGA (35×35 FCBGA) package, enabling dense external connectivity in a surface‑mount form factor.
• Power Core voltage operating range: 870 mV to 930 mV.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C.
• Compliance RoHS compliant.
• Hard IP Integration Includes an Embedded HardCopy Block used to harden IP such as PCIe Gen3/Gen2/Gen1 for streamlined IP deployment and ASIC migration.

Typical Applications

• Optical and Backplane Communications High‑speed transceivers and abundant logic make this device suitable for 40G/100G transport, optical interfaces, and high‑bandwidth backplane applications.
• DSP‑Centric Systems Variable‑precision DSP resources and large embedded memory support signal processing tasks in broadcast, military, and high‑performance computing systems.
• Packet Processing and Network Test Equipment Logic density and transceiver capability enable packet processing, traffic management, and network test functions found in wireline and test instrumentation.
• Prototype to ASIC Migration Use the Stratix V FPGA for prototyping designs and leverage the documented path to HardCopy V ASICs for volume production.

Unique Advantages

• High logic and memory integration: Consolidates large designs with approximately 236,000 logic elements and ~13.3 Mbits of embedded RAM, reducing external component count.
• DSP and transceiver synergy: Variable‑precision DSP blocks paired with 14.1‑Gbps transceivers address transceiver‑based DSP workloads without overspecifying parts.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments.
• Hard IP and ASIC migration: Embedded HardCopy Block and documented HardCopy V path reduce risk and cost when transitioning from FPGA prototyping to ASIC production.
• RoHS compliance: Meets common environmental requirements for commercial and industrial systems.

Why Choose 5SGSMD3H1F35I2N?

The 5SGSMD3H1F35I2N positions itself for designs that require a balance of high logic density, sizable embedded memory, and transceiver‑enabled DSP performance. Its GS variant capabilities make it appropriate for data‑intensive communications, DSP processing, and systems that will benefit from a supported path to ASIC hardening.

Manufactured by Intel and built on the Stratix V family architecture, this device is suited to engineering teams developing high‑bandwidth or DSP‑centric applications who need a reliable, industrial‑rated FPGA with integrated hard IP options for production scalability.

Request a quote or submit an inquiry to evaluate 5SGSMD3H1F35I2N for your next FPGA design and production roadmap.