5SGSMD3H1F35C2WN

The 5SGSMD3H1F35C2WN is a Stratix® V GS field programmable gate array (FPGA) in a 1152‑FBGA, FCBGA package. It provides a high-density programmable fabric with on‑chip memory and a large I/O count for complex digital designs.

Targeted at commercial‑grade applications, this device combines approximately 236,000 logic elements, roughly 13.3 Mbits of embedded memory, and 432 I/O pins to support demanding integration and system‑level requirements while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  Approximately 236,000 logic elements for implementing large-scale custom logic and state machines.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density  432 user I/O pins to support wide bus interfaces, parallel peripherals, and extensive sensor or board connectivity.
• Package  1152‑FBGA (35×35) FCBGA package offering a high pin‑count, compact footprint for system integration.
• Power and Core Voltage  Core supply range specified at 870 mV to 930 mV to match system power planning and regulator selection.
• Commercial Grade and Temperature Range  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Series Electrical and I/O Characteristics  Stratix V device datasheet documents electrical characteristics, I/O timing, programmable I/O element delay, and programmable output buffer delay for detailed system timing and power analysis.

Typical Applications

• Custom Digital Logic and Acceleration  Implement complex, high‑density logic functions and hardware accelerators using the device’s large logic and memory resources.
• High‑Pin‑Count System Integration  Use the 432 I/Os and compact 1152‑FBGA package to consolidate multiple board‑level functions into a single programmable device.
• Prototyping and Development  Leverage the Stratix V architecture for functional prototyping and validation of large digital subsystems.

Unique Advantages

• High Logic Density: Approximately 236,000 logic elements enable implementation of large finite‑state machines, datapaths, and custom compute blocks.
• Significant On‑Chip Memory: Approximately 13.3 Mbits of embedded RAM reduces external memory dependency for many buffering and storage needs.
• Large I/O Count: 432 I/O pins provide flexibility for wide parallel interfaces, high‑speed peripheral connections, and multi‑channel sensor arrays.
• Compact, High‑Pin Package: 1152‑FBGA (35×35) package balances pin count and board footprint for space‑constrained designs.
• Defined Core Voltage Range: Core supply specified at 870 mV to 930 mV helps streamline power‑supply design and thermal planning.
• Commercial Temperature Support: Rated for 0 °C to 85 °C operation to suit commercial applications and environments.

Why Choose 5SGSMD3H1F35C2WN?

The 5SGSMD3H1F35C2WN delivers a balance of high logic capacity, substantial embedded memory, and extensive I/O in a compact 1152‑FBGA package, making it suitable for designs that require dense programmable logic and significant on‑chip resources. As a commercial‑grade Stratix V GS device, it is supported by detailed electrical and I/O timing documentation for system integration and performance planning.

This device is appropriate for teams and projects that need scalable logic density, on‑chip RAM for local data handling, and a high I/O count for board consolidation—backed by Stratix V series documentation for electrical characteristics and timing analysis.

Request a quote or submit an inquiry to get pricing and availability for the 5SGSMD3H1F35C2WN. Our team can provide lead‑time information and technical support for integration and deployment planning.