5SGSMD3H1F35C2LN

The 5SGSMD3H1F35C2LN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-FBGA (35×35) surface-mount package. This commercial-grade device combines high DSP density and substantial embedded memory with integrated transceiver capabilities, making it suited for transceiver‑based, DSP‑centric system designs.

Built on the Stratix V family architecture, the device targets markets that require high-performance signal processing and high-bandwidth connectivity while providing a scalable path to production hardening for higher-volume designs.

Key Features

• Process & core architecture – Stratix V family architecture manufactured on a 28‑nm process with family-level enhancements such as an adaptive logic module (ALM) and comprehensive fabric clocking network.
• Logic capacity – 236,000 logic elements to implement complex custom logic and control functions.
• Embedded memory – Approximately 13.3 Mbits of on-chip RAM (13,312,000 total RAM bits) with 20‑Kbit M20K memory block architecture for local buffering and state storage.
• DSP resources – GS family variable-precision DSP blocks; family documentation describes support for large counts of 18×18 and 27×27 multipliers tailored to high‑precision signal processing.
• Transceivers & I/O – 432 user I/O pins and GS‑variant integrated transceivers with multi-gigabit data‑rate capability for backplane and optical interface applications.
• System integration – Fractional PLLs, multi‑track routing architecture and an Embedded HardCopy Block option (family feature) to harden IP such as PCIe when migrating to ASIC.
• Power and thermal – Core voltage range specified 0.820 V to 0.880 V; commercial operating temperature range 0 °C to 85 °C.
• Packaging & compliance – Surface-mount 1152‑FBGA (35×35) package; RoHS compliant.

Typical Applications

• High-performance DSP systems – Implement complex filtering, transforms, and custom arithmetic using the device’s dense DSP resources and on-chip memory.
• Optical and backplane interfaces – Use integrated GS transceivers and abundant I/O for high-bandwidth serial links and protocol bridges.
• Broadcast and media processing – Realize real‑time video and signal-processing pipelines leveraging the combination of logic, DSP blocks, and embedded RAM.
• High-performance computing (HPC) – Offload compute‑intensive kernels and implement accelerator functions within a programmable fabric.
• Wireline communications – Build packet processing, traffic management, and protocol termination functions that require both DSP and transceiver support.

Unique Advantages

• High DSP density: Large population of variable-precision DSP blocks enables implementation of demanding signal-processing algorithms on-chip.
• Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM supports deep buffering and stateful processing without external memory for many use cases.
• Integrated transceiver capability: GS family transceivers provide multi‑gigabit serial connectivity directly from the FPGA fabric, simplifying high-speed link design.
• Scalable production path: Family-level Embedded HardCopy Block and Stratix V-to-HardCopy migration options provide a documented route to lower-cost ASIC conversion for volume programs.
• Compact, surface-mount packaging: 1152‑FBGA (35×35) package offers a dense I/O footprint while supporting surface-mount assembly processes.
• Commercial temperature and power profile: Defined operating range (0 °C to 85 °C) and core supply window (0.820 V–0.880 V) allow predictable power and thermal planning.

Why Choose 5SGSMD3H1F35C2LN?

The 5SGSMD3H1F35C2LN delivers a balanced combination of logic capacity, DSP resources, embedded memory, and multi‑gigabit transceiver capability in a commercial‑grade Stratix V GS device. It is positioned for designers needing high-performance, DSP-centric FPGA implementations with a clear upgrade path toward hard‑IP ASIC conversion when needed.

For system architects and procurement teams, this device provides a compact package, defined power and temperature characteristics, and family-level features that support complex signal-processing and high-bandwidth interface designs while maintaining RoHS compliance.

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