5SGSMD3H1F35C2LN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,272 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 89000 | Number of Logic Elements/Cells | 236000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13312000 |
Overview of 5SGSMD3H1F35C2LN – Stratix® V GS FPGA, 236,000 logic elements, 1152-FBGA
The 5SGSMD3H1F35C2LN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-FBGA (35×35) surface-mount package. This commercial-grade device combines high DSP density and substantial embedded memory with integrated transceiver capabilities, making it suited for transceiver‑based, DSP‑centric system designs.
Built on the Stratix V family architecture, the device targets markets that require high-performance signal processing and high-bandwidth connectivity while providing a scalable path to production hardening for higher-volume designs.
Key Features
- Process & core architecture – Stratix V family architecture manufactured on a 28‑nm process with family-level enhancements such as an adaptive logic module (ALM) and comprehensive fabric clocking network.
- Logic capacity – 236,000 logic elements to implement complex custom logic and control functions.
- Embedded memory – Approximately 13.3 Mbits of on-chip RAM (13,312,000 total RAM bits) with 20‑Kbit M20K memory block architecture for local buffering and state storage.
- DSP resources – GS family variable-precision DSP blocks; family documentation describes support for large counts of 18×18 and 27×27 multipliers tailored to high‑precision signal processing.
- Transceivers & I/O – 432 user I/O pins and GS‑variant integrated transceivers with multi-gigabit data‑rate capability for backplane and optical interface applications.
- System integration – Fractional PLLs, multi‑track routing architecture and an Embedded HardCopy Block option (family feature) to harden IP such as PCIe when migrating to ASIC.
- Power and thermal – Core voltage range specified 0.820 V to 0.880 V; commercial operating temperature range 0 °C to 85 °C.
- Packaging & compliance – Surface-mount 1152‑FBGA (35×35) package; RoHS compliant.
Typical Applications
- High-performance DSP systems – Implement complex filtering, transforms, and custom arithmetic using the device’s dense DSP resources and on-chip memory.
- Optical and backplane interfaces – Use integrated GS transceivers and abundant I/O for high-bandwidth serial links and protocol bridges.
- Broadcast and media processing – Realize real‑time video and signal-processing pipelines leveraging the combination of logic, DSP blocks, and embedded RAM.
- High-performance computing (HPC) – Offload compute‑intensive kernels and implement accelerator functions within a programmable fabric.
- Wireline communications – Build packet processing, traffic management, and protocol termination functions that require both DSP and transceiver support.
Unique Advantages
- High DSP density: Large population of variable-precision DSP blocks enables implementation of demanding signal-processing algorithms on-chip.
- Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM supports deep buffering and stateful processing without external memory for many use cases.
- Integrated transceiver capability: GS family transceivers provide multi‑gigabit serial connectivity directly from the FPGA fabric, simplifying high-speed link design.
- Scalable production path: Family-level Embedded HardCopy Block and Stratix V-to-HardCopy migration options provide a documented route to lower-cost ASIC conversion for volume programs.
- Compact, surface-mount packaging: 1152‑FBGA (35×35) package offers a dense I/O footprint while supporting surface-mount assembly processes.
- Commercial temperature and power profile: Defined operating range (0 °C to 85 °C) and core supply window (0.820 V–0.880 V) allow predictable power and thermal planning.
Why Choose 5SGSMD3H1F35C2LN?
The 5SGSMD3H1F35C2LN delivers a balanced combination of logic capacity, DSP resources, embedded memory, and multi‑gigabit transceiver capability in a commercial‑grade Stratix V GS device. It is positioned for designers needing high-performance, DSP-centric FPGA implementations with a clear upgrade path toward hard‑IP ASIC conversion when needed.
For system architects and procurement teams, this device provides a compact package, defined power and temperature characteristics, and family-level features that support complex signal-processing and high-bandwidth interface designs while maintaining RoHS compliance.
Request a quote or submit an inquiry to receive pricing, lead‑time, and availability information for the 5SGSMD3H1F35C2LN.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018