5SGSMD3E3H29I4WN

The 5SGSMD3E3H29I4WN is a Stratix® V GS field programmable gate array (FPGA) in a 780-BBGA (FCBGA) package optimized for industrial applications. It integrates a high density of programmable logic, substantial on-chip RAM, and a large I/O count to support complex digital implementations.

Designed for designs that require up to 236,000 logic elements, approximately 13.3 Mbits of embedded memory, and up to 360 I/Os, this device targets high-density logic, advanced interfacing, and industrial-grade operating conditions.

Key Features

• Core Logic  Provides 236,000 logic elements suitable for large-scale digital designs and complex custom logic implementations.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM for buffering, state storage, and embedded data structures.
• I/O Capacity  Up to 360 user I/Os to support broad peripheral connectivity and multi-channel interfacing.
• Package and Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33); surface-mount mounting type for PCB integration.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV for the device core domain.
• Temperature Grade  Industrial grade with an operating temperature range from −40 °C to 100 °C for demanding environments.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Logic- and memory-intensive algorithms that require hundreds of thousands of logic elements and multi-megabit on-chip RAM.
• Industrial control and automation  Industrial-grade operating temperature and robust package make it suitable for control systems and factory automation where extended temperature range is required.
• Connectivity and interface hubs  Large I/O count supports multi-channel interfacing, aggregation, and protocol bridging in communications or data-acquisition systems.

Unique Advantages

• High integration density: Consolidates large amounts of programmable logic and embedded RAM on a single device, reducing external component count.
• Extensive I/O availability: Up to 360 I/Os enable flexible system partitioning and direct attachment of multiple peripherals or interfaces.
• Industrial temperature operation: Rated from −40 °C to 100 °C to support deployment in harsh or temperature-variant environments.
• Compact ball-grid package: 780-BBGA (FCBGA) with a 33×33 supplier package footprint for high-density PCB layouts.
• Low-voltage core: Core supply between 820 mV and 880 mV aligns with modern low-voltage power domains for efficient power distribution.
• Regulatory compliance: RoHS compliance supports use in regulated manufacturing environments.

Why Choose 5SGSMD3E3H29I4WN?

5SGSMD3E3H29I4WN combines a high logic element count with multi-megabit embedded memory and a large I/O complement in a compact FCBGA package, delivering the building blocks needed for complex, high-density FPGA designs. Its industrial temperature rating and surface-mount package make it a practical choice for systems that demand reliable operation across a wide thermal range.

This device is well suited to engineering teams designing scalable, high-capacity digital systems that require significant on-chip resources and broad interfacing options. The combination of integration, thermal range, and RoHS compliance helps simplify board-level design and supports long-term deployment in industrial environments.

Request a quote or submit a product inquiry to obtain pricing, availability, and support for integrating 5SGSMD3E3H29I4WN into your next design.