5SGSMD3H1F35C1N

The 5SGSMD3H1F35C1N is a Stratix V GS FPGA IC in a 1152-FBGA (35×35) surface-mount package, designed for DSP-centric, transceiver-enabled system designs. This commercial-grade device integrates a high-density logic fabric, abundant on-chip memory, variable-precision DSP resources and integrated transceivers for high-bandwidth interfaces.

Key attributes of this Stratix V GS device include 236,000 logic elements, approximately 13.312 Mbits of embedded memory, 432 user I/O, a 0.870–0.930 V core supply window, and an operating range of 0 °C to 85 °C. As part of the Stratix V family, it supports architecture and hard-IP features intended for bandwidth- and DSP-focused applications.

Key Features

• Core & Logic Built on the Stratix V architecture with a redesigned adaptive logic module (ALM); this part provides 236,000 logic elements for complex logic and control implementations.
• On-chip Memory Approximately 13.312 Mbits of total RAM bits implemented with dedicated M20K embedded memory blocks to support large buffering, packet processing, and algorithm state storage.
• DSP & Hard IP Stratix V GS family devices include abundant variable-precision DSP blocks (family-level support up to 3,926 18×18 or 1,963 27×27 multipliers) and an Embedded HardCopy Block for hardening IP such as PCIe Gen3/Gen2/Gen1 instantiations.
• High-speed Transceivers GS devices offer integrated transceivers with 14.1‑Gbps data-rate capability, suitable for backplane and optical-interface applications.
• I/O & Package 432 user I/O pins and a 1152-FBGA (35×35) surface-mount package (1152-BBGA, FCBGA package case) for dense board-level integration.
• Power & Thermal Core voltage supply range from 870 mV to 930 mV and a commercial operating temperature range of 0 °C to 85 °C.

Typical Applications

• Wireline and Packet Processing Use the device’s large logic capacity and on-chip memory for high-throughput packet classification, traffic management, and complex protocol handling.
• Transceiver-based DSP Systems Leverage variable-precision DSP blocks and integrated 14.1‑Gbps transceivers for real-time signal processing in broadcast, communications, and test equipment.
• Optical and Backplane Interfaces Integrated transceivers and high I/O count support high-speed optical and backplane link implementations.
• High-performance Computing Combine abundant logic, DSP resources, and embedded memory for acceleration tasks and compute-intensive pipelines.

Unique Advantages

• High integration density: 236,000 logic elements and substantial embedded memory reduce external component count and simplify complex designs.
• DSP-oriented architecture: Family-level variable-precision DSP resources and support for thousands of multipliers accelerate signal-processing workloads.
• High-speed I/O capability: Integrated 14.1‑Gbps transceivers enable implementation of demanding interface standards and high-bandwidth links.
• Production migration path: Stratix V devices offer a low-risk, low-cost route to HardCopy V ASICs for volume production needs.
• Commercial-grade performance: Designed for 0 °C to 85 °C operation with a defined core supply window (870–930 mV) for predictable power and thermal planning.

Why Choose 5SGSMD3H1F35C1N?

The 5SGSMD3H1F35C1N positions itself as a high-density, DSP-optimized Stratix V GS FPGA suitable for designers building transceiver-enabled, compute- and bandwidth-intensive systems. Its combination of 236,000 logic elements, substantial embedded memory, integrated high-speed transceivers and DSP resources makes it appropriate for wireline communications, broadcast, optical interfaces and high-performance compute applications.

As part of the Stratix V family, this device supports family-level hard-IP and production migration options, offering a clear path from prototyping to higher-volume ASIC conversion while retaining access to the Stratix V feature set and Intel’s device ecosystem.

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