5SGSMD3H1F35C1G

The 5SGSMD3H1F35C1G is an Intel Stratix® V GS field programmable gate array (FPGA) offered in a high-density FCBGA package. It combines substantial programmable logic capacity, embedded RAM, and a large I/O count in a surface-mount 1152-BBGA footprint.

This device is suitable for designs that require significant on-chip logic and memory resources along with extensive I/O connectivity within a commercial temperature range.

Key Features

• Logic Capacity: 236,000 logic elements, providing a large programmable fabric for complex digital designs.
• Embedded Memory: Approximately 13.3 Mbits of on-chip RAM (13,312,000 total RAM bits) to support buffering, FIFOs, and local data storage.
• I/O Resources: 432 user I/O pins to enable broad peripheral and interface connectivity.
• Power Supply: Core voltage supply range of 870 mV to 930 mV for device operation.
• Package & Mounting: 1152-BBGA (FCBGA) package; supplier package listed as 1152-FBGA (35×35). Designed for surface-mount assembly.
• Operating Grade & Temperature: Commercial grade device rated for 0 °C to 85 °C.
• Compliance: RoHS compliant.

Typical Applications

• Networking & Communications: Deploy programmable logic and embedded RAM for packet processing and protocol handling where high I/O and memory capacity are required.
• Data Processing & DSP: Use the abundant logic elements and on-chip RAM for custom data-paths, buffering, and algorithm acceleration.
• Prototyping & Custom Computing: Implement complex custom hardware functions and system integration tasks that demand substantial programmable resources.

Unique Advantages

• High logic density: 236,000 logic elements enable complex designs and extensive custom logic implementation on a single device.
• Significant embedded memory: Approximately 13.3 Mbits of on-chip RAM reduces dependence on external memory for intermediate storage and high-speed buffering.
• Wide I/O capability: 432 I/O pins provide the flexibility to connect multiple peripherals, interfaces, and high-pin-count subsystems.
• Compact FCBGA package: 1152-BBGA (35×35 supplier package) delivers a dense footprint for board designs that require many signals in a constrained area.
• Documented Intel support: Backed by the Stratix V device datasheet and Intel technical documentation for electrical and switching characteristics.

Why Choose 5SGSMD3H1F35C1G?

The 5SGSMD3H1F35C1G delivers a balanced combination of logic density, on-chip memory, and high I/O count in a commercial-grade Stratix V GS FPGA. It is well suited for engineers and designers who need a programmable platform capable of integrating large custom logic functions and memory-intensive data paths in a single surface-mount package.

With Intel documentation available for electrical and switching characteristics, this device supports designs that require verifiable operating conditions and clear package specifications, helping teams accelerate development and system integration.

Request a quote or submit a pricing and availability inquiry to evaluate the 5SGSMD3H1F35C1G for your next design.