5SGSMD3E3H29I3L

The 5SGSMD3E3H29I3L is a Stratix® V GS field-programmable gate array (FPGA) in a high-pin-count FCBGA package. It provides a large programmable fabric tailored for industrial-grade designs that require high logic capacity, abundant on-chip memory, and substantial I/O connectivity.

With 236,000 logic elements, approximately 13.3 Mbits of embedded memory, and 360 I/Os, this device is intended for system-level implementations where integration and deterministic operating conditions matter. It supports surface-mount assembly and is specified for industrial temperature operation.

Key Features

• Core Logic — 236,000 logic elements provide a high-density programmable fabric for complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 13.3 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory for many workloads.
• I/O Capacity — 360 general-purpose I/Os enable broad connectivity for sensors, peripherals, and board-level interfaces.
• Power Supply — Specified core supply range of 0.82 V to 0.88 V to match system power-rail planning and power budgeting.
• Package & Mounting — 780-BBGA FCBGA package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting for standard PCB assembly flows.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• RoHS Compliant — Device meets RoHS requirements for restricted substances.

Typical Applications

• High-density FPGA designs — Use the large logic and memory resources to implement complex control, signal-processing, or protocol-bridging functions on a single device.
• Industrial control & automation — Industrial temperature rating and extensive I/O support sensor interfacing, motor control logic, and deterministic control tasks.
• High-throughput data paths — On-chip memory and abundant I/O pins support buffering and parallel data movement for high-bandwidth system segments.

Unique Advantages

• Substantial logic capacity: 236,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing system-level component count.
• Significant embedded memory: Approximately 13.3 Mbits of RAM reduces reliance on external memory for many designs, simplifying board layout and BOM.
• Extensive I/O: 360 I/Os allow direct interfacing to a wide range of peripherals and modules without additional bridge devices.
• Industrial operating range: Rated −40 °C to 100 °C for deployment in environments that require extended temperature tolerance.
• High-pin FCBGA package: 780-ball BGA footprint (supplier: 780-HBGA 33×33) supports high-density routing and robust signal distribution on multi-layer PCBs.
• Regulatory alignment: RoHS compliance supports use in products requiring restricted-substance conformance.

Why Choose 5SGSMD3E3H29I3L?

The 5SGSMD3E3H29I3L delivers a combination of high logic density, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GS FPGA. It is positioned for engineers who need to integrate complex digital functions and significant data buffering on a single, surface-mount package while maintaining operation across a broad temperature range.

As part of the Stratix V family, this device aligns with established device documentation and design flows, providing a predictable platform for medium- to high-complexity system designs that prioritize integration, deterministic operation, and long-term availability.

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