5SGSMD3E3H29C4WN

The 5SGSMD3E3H29C4WN is a commercial-grade Stratix® V GS field programmable gate array (FPGA) from Intel, optimized for designs that require high logic density, substantial on-chip memory, and a large I/O count. This device is offered in a 780-BBGA FCBGA package and is supplied in a 780-HBGA (33×33) package outline for surface-mount assembly.

With approximately 236,000 logic elements and roughly 13.3 Mbits of embedded memory, the device targets complex digital signal processing, multi-channel interfacing, and system integration applications where integration and performance density are primary considerations.

Key Features

• Core / Logic Capacity  Approximately 236,000 logic elements provide large on-chip programmable logic for complex functions and parallel architectures.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms without external memory for many workloads.
• I/O & Connectivity  360 I/Os enable multi-channel interfaces and high pin-count system connectivity for dense board-level integration.
• Package & Mounting  780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33) designed for surface-mount PCB assembly and compact system designs.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match system power domains and enable expected Stratix V core operation.
• Temperature & Grade  Commercial device grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Compliance  RoHS compliant.

Typical Applications

• High-density signal processing  Leverage the large logic capacity and on-chip memory for complex DSP algorithms and real-time data processing.
• Multi-channel interface systems  360 I/Os support dense peripheral and sensor interfaces, enabling multi-lane or multi-channel designs on a single device.
• Prototyping and system integration  Commercial-grade Stratix V GS devices are suitable for system validation and integration where high logic and memory resources are required.
• Network and communications modules  The Stratix V GS family provides architecture and options appropriate for designs that require integrated transceiver capabilities and substantial logic resources.

Unique Advantages

• Large programmable fabric: Approximately 236,000 logic elements enable consolidation of multi-function logic into a single FPGA, reducing external component count.
• Significant on-chip memory: Roughly 13.3 Mbits of embedded RAM reduce dependence on external memory for many buffering and algorithmic tasks.
• High I/O capacity: 360 I/Os provide the flexibility to connect numerous peripherals, sensors, and interfaces without additional I/O expanders.
• Compact, PCB-friendly package: 780-BBGA (33×33 supplier package) for dense implementations and surface-mount assembly workflows.
• Commercial-grade operating range: 0 °C to 85 °C operation aligns with standard commercial deployment environments.

Why Choose 5SGSMD3E3H29C4WN?

The 5SGSMD3E3H29C4WN brings together high logic density, substantial embedded memory, and a large I/O complement in a compact FCBGA package, making it well suited for engineers building complex, integration-forward digital systems. As a commercial-grade Stratix V GS device from Intel, it benefits from the family’s documented electrical and switching characteristics and the broader Stratix V device datasheet guidance.

This part is appropriate for designs that prioritize on-chip capacity and connectivity—enabling consolidation of functions, simplified board routing, and reduced external BOM for medium- to high-complexity systems.

Request a quote or submit an RFQ to receive pricing and availability information for the 5SGSMD3E3H29C4WN.