5SGSMD3E3H29C4G

The 5SGSMD3E3H29C4G is a Stratix V GS family FPGA in a 780-BBGA (FCBGA) package designed for complex programmable logic implementations. It provides a high-density fabric with abundant I/O and embedded memory to support demanding digital processing, signal interfacing, and high-speed transceiver-capable designs.

This device targets commercial temperature applications and emphasizes integration of logic, memory, and I/O resources to enable advanced system designs that require substantial on-chip resources and flexible board-level mounting.

Key Features

• Logic Capacity  Approximately 236,000 logic elements, enabling sizable custom logic implementations and complex state machines.
• Logic Array Blocks (LABs)  89,000 LABs for structured logic organization and resource allocation across the fabric.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM for high-bandwidth buffering, FIFOs, and local storage.
• I/O Resources  360 user I/Os to support wide parallel interfaces, multiple peripheral connections, and board-level integration.
• Power and Core Supply  Core voltage supply range of 820 mV to 880 mV to match platform power delivery and core performance requirements.
• Package & Mounting  780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33), with surface-mount installation for compact PCB layouts.
• Operating Temperature  Commercial temperature grade specified from 0 °C to 85 °C for typical commercial deployments.
• Regulatory Compliance  RoHS compliant to support environmentally conscious manufacturing and assembly.

Typical Applications

• High-performance digital processing  On-chip logic capacity and embedded RAM support compute-intensive custom datapaths and algorithm acceleration.
• Communications and interfacing  Large I/O count and Stratix V GS family transceiver heritage enable complex interface handling and multi-channel I/O aggregation.
• Prototyping and complex system integration  Dense logic and memory resources make the device suitable for system prototypes and consolidating multiple functions into a single FPGA.

Unique Advantages

• High logic density: 236,000 logic elements provide the capacity required for large-scale implementations without immediate need for multiple devices.
• Substantial embedded memory: Approximately 13.3 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O connectivity: 360 I/Os accommodate broad peripheral integration and parallel buses, simplifying board-level routing and partitioning.
• Commercial temperature suitability: Rated 0 °C to 85 °C for commercial-class projects and environments.
• Surface-mount FCBGA packaging: 780-BBGA (33×33 HBGA supplier package) supports compact, high-density PCB layouts common in advanced electronic systems.
• RoHS compliant: Meets lead-free and restricted-substance requirements for modern manufacturing flows.

Why Choose 5SGSMD3E3H29C4G?

The 5SGSMD3E3H29C4G delivers a combination of high logic capacity, abundant embedded memory, and extensive I/O in a compact surface-mount BGA package. Its specifications align with commercial-class designs that require integrated, high-density programmable logic and substantial on-chip resources.

Designers seeking a Stratix V GS family FPGA for advanced digital processing, interface consolidation, or prototype systems will find this device well suited for workloads that demand significant logic and memory resources while remaining within commercial temperature and power envelopes.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGSMD3E3H29C4G and to discuss how this FPGA can fit your next design.