5SGSMD3E3H29C2WN

The 5SGSMD3E3H29C2WN is a Stratix® V GS family field programmable gate array (FPGA) from Intel, offered in a 780‑BBGA (FCBGA) package. This commercial‑grade device provides high logic capacity, substantial embedded memory, and extensive I/O for complex digital designs.

Designed for surface‑mount deployment, the device targets applications that require large on‑chip logic and memory resources while operating within a commercial temperature range and a low‑voltage core supply.

Key Features

• Logic Capacity  Provides 236,000 logic elements to implement large, complex FPGA designs.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM for buffering, lookup tables, and storage-intensive functions.
• I/O Density  360 user I/O pins to support wide parallel interfaces and multiple high‑fanout connections.
• Core Voltage  Low‑voltage core operation with a specified supply range of 870 mV to 930 mV.
• Package & Mounting  780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33). Surface mount type for PCB assembly.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• High‑density logic systems  Implement complex state machines, custom processors, and large logic datapaths using the device’s 236,000 logic elements.
• On‑chip buffering and memory functions  Leverage approximately 13.3 Mbits of embedded RAM for FIFOs, packet buffers, and LUT‑based storage.
• Multi‑interface controllers  Use the 360 I/O pins to connect multiple parallel buses, peripherals, or front‑end interfaces in a single device.

Unique Advantages

• High logic integration: With 236,000 logic elements, designers can consolidate functionality that would otherwise require multiple devices.
• Substantial embedded memory: Approximately 13.3 Mbits of on‑chip RAM reduces the need for external memory in many buffering and data‑path applications.
• Dense I/O in a compact package: 360 I/O pins in a 780‑BBGA package enable high‑connectivity designs while maintaining a board‑level footprint suitable for surface‑mount assembly.
• Low‑voltage core: Core supply specified between 870 mV and 930 mV supports designs targeting lower core power domains.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet standard commercial‑grade system requirements.
• RoHS compliant: Aligns with lead‑free manufacturing and environmental compliance needs.

Why Choose 5SGSMD3E3H29C2WN?

The 5SGSMD3E3H29C2WN delivers a combination of high logic density, significant on‑chip memory, and plentiful I/O in a single Stratix® V GS FPGA package from Intel. Its low core voltage and commercial temperature rating make it suitable for mainstream, performance‑oriented designs that require consolidation of logic and memory resources.

This part is well suited for engineers and procurement teams building systems that need large embedded capacity and flexible interfacing without resorting to multiple discrete devices. As a member of the Stratix V family, it aligns with standard FPGA development workflows and device documentation for integration into production designs.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGSMD3E3H29C2WN.