5SGSMD3E3H29C2LG

The 5SGSMD3E3H29C2LG is a Stratix® V GS field programmable gate array (FPGA) offering high logic density and substantial on-chip memory in a surface-mount 780-BBGA (FCBGA) package. Designed for commercial-grade applications, the device combines large logic resources and abundant I/O capacity to support complex, deeply integrated digital designs.

With a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C, this FPGA is suited to systems that require extensive programmable logic, embedded memory, and a high count of I/O signals within a compact BGA footprint.

Key Features

• Core Logic  236,000 logic elements provide high-density programmable logic for complex digital designs and custom hardware architectures.
• Embedded Memory  Approximately 13.312 Mbits of on-chip RAM to support large buffers, FIFOs, and data-path storage without external memory.
• I/O Capacity  360 I/O pins to accommodate wide buses, numerous peripherals, and multi-channel interfacing in a single device.
• Power and Core Voltage  Core voltage supply range of 820 mV to 880 mV to match low-voltage core power domains.
• Package & Mounting  Surface-mount 780-BBGA (supplier package: 780-HBGA, 33×33) for high pin-count, compact board-level integration.
• Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting modern environmental requirements.

Typical Applications

• High-density programmable logic  Implement complex state machines, custom accelerators, and multi-function digital subsystems leveraging 236,000 logic elements.
• Data buffering and on-chip storage  Use the approximately 13.3 Mbits of embedded memory for large FIFOs, packet buffering, and temporary data storage without immediate external memory dependence.
• Multi-channel I/O systems  Support many parallel interfaces and peripherals with 360 available I/Os in a single FPGA package.

Unique Advantages

• High logic integration: The device’s 236,000 logic elements enable consolidation of multiple functions into one FPGA, reducing BOM and board complexity.
• Substantial embedded memory: Approximately 13.312 Mbits of on-chip RAM minimizes external memory requirements for many designs.
• Extensive I/O resources: 360 I/Os provide flexibility for interfacing to a broad set of peripherals and parallel buses.
• Compact BGA packaging: The 780-BBGA surface-mount package delivers a high pin count in a compact footprint for dense PCB layouts.
• Commercial-grade operating range: Rated for 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets environmental compliance expectations for contemporary product design.

Why Choose 5SGSMD3E3H29C2LG?

The 5SGSMD3E3H29C2LG positions itself for designs that require a combination of high programmable logic capacity, meaningful on-chip memory, and a large I/O complement within a compact BGA package. Its commercial-grade rating and defined operating voltage and temperature ranges make it suitable for mainstream embedded and communications-oriented applications that need substantial integration without external components.

As a member of the Stratix V family, the device offers the attributes expected from that series—large logic resources, extensive I/O, and significant embedded RAM—making it a practical choice for engineering teams aiming to consolidate functions and streamline system architectures.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGSMD3E3H29C2LG for your next high-density FPGA design.