5SGSMD3E3H29C2L

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 446 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E3H29C2L – Stratix V GS FPGA, 236,000 LEs, 360 I/O, 780-BBGA

The 5SGSMD3E3H29C2L is a Stratix V GS field-programmable gate array (FPGA) offered in a 780-ball FCBGA package. Built on a 28-nm process and the Stratix V architecture, this device combines high logic density, substantial embedded memory, and DSP-targeted resources for transceiver-enabled, signal-processing applications.

With 236,000 logic elements, approximately 13.3 Mbits of on-chip RAM and 360 I/O pins, this commercial-grade device targets bandwidth- and DSP-centric systems that benefit from integrated transceivers and hardened IP options at the device-family level.

Key Features

  • Logic Capacity — 236,000 logic elements to implement complex custom logic and control paths.
  • Embedded Memory — Approximately 13.3 Mbits of on-chip RAM using 20-Kbit memory blocks at the device-family level for buffering and state storage.
  • DSP Resources — Stratix V GS family provides abundant variable-precision DSP blocks and multiplier resources for high-performance signal processing.
  • High-Speed Serial — GS devices include integrated transceivers with up to 14.1-Gbps data-rate capability (series-level feature) for backplane and optical interface applications.
  • I/O Density — 360 I/O pins to support multi-channel interfaces and system integration.
  • Process and Core Voltage — 28-nm TSMC technology with a device supply range of 0.820–0.880 V (core supply specified in product data).
  • Package and Mounting — 780-BBGA (FCBGA) 33 × 33 supplier package in a surface-mount form factor for compact board-level integration.
  • Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C and RoHS compliance.
  • Hard IP and Architecture — Series-level features include a redesigned adaptive logic module (ALM), multi-track routing, fractional PLLs and an Embedded HardCopy Block for hardened IP instantiation.

Typical Applications

  • Telecommunications and Optical Transport — Implement packet processing, backplane interfaces and optical system functions using integrated transceivers and high logic/memory capacity.
  • High-Performance DSP — Deploy variable-precision DSP blocks and large multiplier arrays for compute-intensive signal-processing pipelines.
  • Network and Data Center Equipment — Use the device’s logic density and on-chip memory for traffic management, protocol offload and accelerated data-path functions.
  • Broadcast and Test Equipment — Leverage transceiver capability and DSP resources for high-bandwidth streaming, capture and analysis applications.

Unique Advantages

  • High logic density: 236,000 logic elements provide room for complex control, protocol and data-path implementations without external logic expansion.
  • Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces dependence on external memory for buffering and low-latency storage.
  • DSP-optimized architecture: Stratix V GS family DSP resources and multipliers support precision-tailored signal processing workflows.
  • Integrated serial connectivity: Family-level transceivers with 14.1-Gbps capability enable high-bandwidth serial links for modern communications and transport interfaces.
  • Compact, surface-mount package: The 780-BBGA (33 × 33) FCBGA package supports dense board-level integration while providing 360 I/O for system connectivity.
  • Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for standard commercial deployments.

Why Choose 5SGSMD3E3H29C2L?

The 5SGSMD3E3H29C2L delivers a balanced combination of logic capacity, embedded memory and DSP-oriented resources in a package designed for high-density, high-bandwidth applications. As a Stratix V GS device, it brings series-level features—like integrated transceivers and hardened IP options—together with device-specific specifications that suit communications, DSP and data-path designs.

This device is well suited for engineering teams seeking a commercial-grade FPGA with strong on-chip memory, plentiful I/O and the option to leverage Stratix V family documentation and migration paths within the vendor ecosystem.

Request a quote or submit a purchase inquiry to receive pricing, lead-time and order information for part number 5SGSMD3E3H29C2L.

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