5SGSMD3E2H29I3LN

The 5SGSMD3E2H29I3LN is a Stratix V GS family FPGA optimized for high-density programmable logic implementations. It provides a large array of logic elements, substantial on-chip memory, and a high I/O count in a compact FCBGA package, targeted at industrial temperature operation.

Designed for applications that require significant integration of custom digital logic, the device’s documented electrical and switching characteristics support deployment in environments with defined industrial operating requirements.

Key Features

• Core Logic  Approximately 236,000 logic elements for implementing large-scale custom digital functions.
• Embedded Memory  Approximately 13.312 Mbits of on-chip RAM available for data buffering, state storage, and memory-intensive logic.
• I/O Capacity  360 user I/O pins to support broad peripheral connectivity and parallel interfaces.
• Power  Core supply voltage range of 820 mV to 880 mV to match low-voltage FPGA core rails.
• Package  780-BBGA FCBGA (supplier package: 780-HBGA, 33 × 33) surface-mount package for dense system integration.
• Temperature Grade  Industrial-grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting & Compliance  Surface-mount device; RoHS compliant.

Typical Applications

• High-density logic systems  Implement complex custom datapaths and control logic using the device’s large logic-element capacity.
• Memory-intensive designs  Use the device’s approximately 13.312 Mbits of embedded RAM for buffering, FIFOs, and local storage.
• High-pin-count interfacing  Leverage 360 I/Os for parallel buses, wide interfaces, and mixed-signal control planes.
• Industrial automation and control  Deploy in industrial environments where the −40 °C to 100 °C operating range and surface-mount BBGA package are desirable.

Unique Advantages

• High logic density: Approximately 236,000 logic elements allow consolidation of complex functions into a single device, reducing system BOM.
• Substantial on-chip memory: Approximately 13.312 Mbits of embedded RAM supports data-path acceleration and local buffering without external memory.
• Extensive I/O: 360 I/Os enable broad connectivity options and support for parallel and multiplexed interfaces.
• Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet robust deployment requirements.
• Compact, surface-mount package: 780-BBGA (33 × 33) package balances pin count and board-space efficiency for high-density PCBs.
• Low-voltage core operation: 0.82–0.88 V core supply range aligns with modern low-voltage FPGA power domains.

Why Choose 5SGSMD3E2H29I3LN?

The 5SGSMD3E2H29I3LN positions itself as a high-density Stratix V GS FPGA option for designs that need significant programmable logic, plentiful embedded RAM, and a large I/O complement in an industrial-grade, surface-mount package. Its specifications are documented in the Stratix V device datasheet, providing electrical and switching characteristics developers rely on during system design.

This device is well suited for engineering teams building integrated digital systems where consolidation of logic, local memory resources, and reliable operation across a wide temperature range provide tangible system-level benefits and design longevity.

Request a quote or submit a purchase inquiry to evaluate lead times and pricing for the 5SGSMD3E2H29I3LN.