5SGSMD3E2H29I3G

The 5SGSMD3E2H29I3G is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) in a 780‑ball BGA (FCBGA) surface‑mount package. It delivers high-density programmable logic, on‑chip RAM, and a broad I/O count for complex, board‑level integration.

This industrial‑grade device provides 236,000 logic elements, approximately 13.312 Mbits of embedded memory, and 360 user I/Os. Key electrical characteristics include a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core / Logic Capacity 236,000 logic elements (cells) for high‑density logic implementation and complex state machines.
• Embedded Memory Approximately 13.312 Mbits of on‑chip RAM (13,312,000 bits) to support buffering, FIFOs, and local storage.
• I/O Density 360 user I/Os to connect multiple peripherals, interfaces, and board subsystems without the need for extensive external glue logic.
• Package & Mounting 780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33); surface‑mount mounting type for compact PCB integration.
• Power Defined core voltage supply range of 820 mV to 880 mV for core power domain planning and supply design.
• Temperature & Grade Industrial grade device with an operating temperature range from −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory RoHS‑compliant material status.
• Stratix V Series Documentation Device is part of the Stratix V family; series documentation covers electrical and switching characteristics, operating conditions, and transceiver speed grade offerings.

Typical Applications

• High‑density digital processing — Use the large logic capacity and embedded RAM to implement complex datapaths, packet processing, or custom accelerators.
• High‑speed serial interfaces — Stratix V GS devices include transceiver speed grade offerings in the family datasheet, supporting designs that require high‑speed serial links and board‑level serialization/deserialization.
• Industrial control and instrumentation — Industrial temperature rating (−40 °C to 100 °C) and extensive I/O make the device suitable for hardened control and measurement systems.
• System integration and prototyping — Abundant I/O and dense logic enable consolidation of multiple functions onto a single FPGA for rapid prototyping and tight system integration.

Unique Advantages

• High integration density: 236,000 logic elements and substantial on‑chip RAM reduce the need for external logic and memory components.
• Ample I/O for system consolidation: 360 user I/Os let you combine multiple interfaces and subsystems directly on the FPGA.
• Industrial readiness: Industrial grade and a wide operating temperature range support deployment in demanding environments.
• Compact board footprint: 780‑BBGA (33×33) FCBGA package minimizes PCB area while providing high pin count.
• Defined core power domain: 820–880 mV supply range enables predictable core power planning and voltage regulation design.
• Standards compliance: RoHS‑compliant materials simplify regulatory considerations for many product lines.

Why Choose 5SGSMD3E2H29I3G?

The 5SGSMD3E2H29I3G positions itself as a high‑density, industrial‑grade Stratix V GS FPGA suited for designers who require a large logic fabric, multi‑megabit on‑chip memory, and significant I/O capability in a compact surface‑mount package. Its documented electrical characteristics and Stratix V family guidance support careful system design and power planning.

This device is appropriate for engineering teams building complex digital systems that demand integration, thermal resilience, and a predictable core power domain—backed by the Stratix V series documentation from the manufacturer.

Request a quote or submit an inquiry for pricing, availability, and lead‑time information for the 5SGSMD3E2H29I3G Stratix V GS FPGA.