5SGSMD3E2H29I2LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,693 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 89000 | Number of Logic Elements/Cells | 236000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 13312000 |
Overview of 5SGSMD3E2H29I2LG – Stratix® V GS Field Programmable Gate Array (FPGA) IC
The 5SGSMD3E2H29I2LG is a Stratix V GS family Field Programmable Gate Array (FPGA) IC designed for industrial applications that require high-density programmable logic and extensive on-chip memory. This device delivers approximately 236,000 logic elements and approximately 13.3 Mbits of embedded memory, combined with 360 user I/Os to support complex digital designs and dense I/O integration.
Packaged in a 780-ball BGA (FCBGA / supplier package: 780-HBGA, 33×33) and rated for industrial temperature operation from –40 °C to 100 °C, the device operates with a voltage supply range of 820 mV to 880 mV and is RoHS compliant.
Key Features
- Core & Logic Approximately 236,000 logic elements to implement large, complex logic functions and custom hardware accelerators.
- Embedded Memory Approximately 13.3 Mbits of on-chip RAM for buffering, LUTs, and local data storage to support state machines and data-paths.
- I/O Capacity 360 user I/O pins to interface with peripherals, sensors, and high-density board-level interconnects.
- Power Specified voltage supply range of 820 mV to 880 mV to match system power-rail requirements and core operating conditions.
- Package & Mounting 780-ball BGA (FCBGA) package, supplier package 780-HBGA (33×33), designed for surface-mount PCB assembly.
- Temperature & Grade Industrial-grade device rated for operation from –40 °C to 100 °C for deployment in demanding environments.
- Standards & Compliance RoHS compliant to meet environmental regulatory requirements.
- Series Documentation Device electrical characteristics, I/O timing, and transceiver/switching information are detailed in the Stratix V device datasheet for design validation and system integration.
Typical Applications
- Industrial control systems Industrial temperature rating and high I/O count support sensor interfacing, actuator control, and real-time logic in factory and process-automation equipment.
- Communications and networking Dense logic resources and on-chip memory enable packet processing, protocol offload, and custom networking functions where multi-gigabit transceiver and I/O timing are required (see series datasheet for transceiver details).
- High-density signal processing Large logic element count and embedded RAM are suited for DSP blocks, custom data-paths, and hardware-accelerated algorithms.
- Prototyping and system integration Programmable fabric with extensive I/O facilitates rapid prototyping and integration of complex mixed-signal control and digital subsystems.
Unique Advantages
- High logic density: Approximately 236,000 logic elements enable consolidation of multiple functions onto a single device, reducing board-level component count.
- Substantial embedded memory: Approximately 13.3 Mbits of on-chip RAM provide local storage to reduce external memory dependency and improve data throughput.
- Large I/O complement: 360 I/Os simplify interfacing with multiple peripherals and high-pin-count sensors or connectors without extensive routing compromises.
- Industrial operating range: –40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
- Surface-mount BGA package: 780-ball FCBGA (33×33) offers a compact footprint with high pin density for advanced PCB designs.
- Regulatory compliance: RoHS compliance supports environmentally regulated product development and global market requirements.
Why Choose 5SGSMD3E2H29I2LG?
The 5SGSMD3E2H29I2LG positions itself as a high-density, industrial-grade FPGA option within the Stratix V GS family, combining substantial logic resources, meaningful on-chip memory, and a large I/O complement in a compact 780-ball BGA package. These characteristics make it suitable for engineers designing complex digital systems that demand integration, thermal robustness, and a strong on-chip resource set.
With detailed device electrical and timing information available in the Stratix V datasheet, designers can validate power, I/O timing, and transceiver behavior for reliable system integration and long-term deployment.
Request a quote or submit an inquiry to receive pricing, availability, and technical support for the 5SGSMD3E2H29I2LG Stratix V GS FPGA.

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