5SGSMD3E2H29I2LG

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 1,693 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E2H29I2LG – Stratix® V GS Field Programmable Gate Array (FPGA) IC

The 5SGSMD3E2H29I2LG is a Stratix V GS family Field Programmable Gate Array (FPGA) IC designed for industrial applications that require high-density programmable logic and extensive on-chip memory. This device delivers approximately 236,000 logic elements and approximately 13.3 Mbits of embedded memory, combined with 360 user I/Os to support complex digital designs and dense I/O integration.

Packaged in a 780-ball BGA (FCBGA / supplier package: 780-HBGA, 33×33) and rated for industrial temperature operation from –40 °C to 100 °C, the device operates with a voltage supply range of 820 mV to 880 mV and is RoHS compliant.

Key Features

  • Core & Logic  Approximately 236,000 logic elements to implement large, complex logic functions and custom hardware accelerators.
  • Embedded Memory  Approximately 13.3 Mbits of on-chip RAM for buffering, LUTs, and local data storage to support state machines and data-paths.
  • I/O Capacity  360 user I/O pins to interface with peripherals, sensors, and high-density board-level interconnects.
  • Power  Specified voltage supply range of 820 mV to 880 mV to match system power-rail requirements and core operating conditions.
  • Package & Mounting  780-ball BGA (FCBGA) package, supplier package 780-HBGA (33×33), designed for surface-mount PCB assembly.
  • Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C for deployment in demanding environments.
  • Standards & Compliance  RoHS compliant to meet environmental regulatory requirements.
  • Series Documentation  Device electrical characteristics, I/O timing, and transceiver/switching information are detailed in the Stratix V device datasheet for design validation and system integration.

Typical Applications

  • Industrial control systems  Industrial temperature rating and high I/O count support sensor interfacing, actuator control, and real-time logic in factory and process-automation equipment.
  • Communications and networking  Dense logic resources and on-chip memory enable packet processing, protocol offload, and custom networking functions where multi-gigabit transceiver and I/O timing are required (see series datasheet for transceiver details).
  • High-density signal processing  Large logic element count and embedded RAM are suited for DSP blocks, custom data-paths, and hardware-accelerated algorithms.
  • Prototyping and system integration  Programmable fabric with extensive I/O facilitates rapid prototyping and integration of complex mixed-signal control and digital subsystems.

Unique Advantages

  • High logic density: Approximately 236,000 logic elements enable consolidation of multiple functions onto a single device, reducing board-level component count.
  • Substantial embedded memory: Approximately 13.3 Mbits of on-chip RAM provide local storage to reduce external memory dependency and improve data throughput.
  • Large I/O complement: 360 I/Os simplify interfacing with multiple peripherals and high-pin-count sensors or connectors without extensive routing compromises.
  • Industrial operating range: –40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
  • Surface-mount BGA package: 780-ball FCBGA (33×33) offers a compact footprint with high pin density for advanced PCB designs.
  • Regulatory compliance: RoHS compliance supports environmentally regulated product development and global market requirements.

Why Choose 5SGSMD3E2H29I2LG?

The 5SGSMD3E2H29I2LG positions itself as a high-density, industrial-grade FPGA option within the Stratix V GS family, combining substantial logic resources, meaningful on-chip memory, and a large I/O complement in a compact 780-ball BGA package. These characteristics make it suitable for engineers designing complex digital systems that demand integration, thermal robustness, and a strong on-chip resource set.

With detailed device electrical and timing information available in the Stratix V datasheet, designers can validate power, I/O timing, and transceiver behavior for reliable system integration and long-term deployment.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the 5SGSMD3E2H29I2LG Stratix V GS FPGA.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up