5SGSMD3E2H29C3WN

The 5SGSMD3E2H29C3WN is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) supplied in a 780-BBGA (FCBGA) package. It delivers high logic capacity and substantial on-chip RAM in a surface-mount, commercial-temperature FPGA suitable for complex programmable logic implementations.

Designed for applications that require large programmable logic resources, abundant I/O and compact package integration, this device provides a combination of logic, embedded memory, and I/O count that supports dense system designs while operating in a commercial temperature range.

Key Features

• Core Logic — 236,000 logic elements available for implementing large-scale programmable logic and custom hardware functions.
• Embedded Memory — Approximately 13.3 Mbits of on-chip RAM to support data buffering, block memory, and state storage within the FPGA fabric.
• I/O Capacity — 360 I/O pins to interface with multiple peripherals, sensors, memories, and high-pin-count system buses.
• Package & Mounting — 780-BBGA (FCBGA) package, 780-HBGA (33×33) supplier package; surface-mount mounting type for compact board-level integration.
• Power — Core voltage supply range of 820 mV to 880 mV for supported power rails and board power planning.
• Temperature Grade — Commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial electronics environments.
• Compliance — RoHS compliant, supporting regulatory and environmental requirements for lead-free assemblies.

Typical Applications

• High-density programmable logic — Implement large custom logic blocks and state machines using the device's 236,000 logic elements.
• On-chip data buffering and memory-heavy functions — Leverage approximately 13.3 Mbits of embedded RAM for buffering, packet buffering, or local data storage.
• Multi-channel I/O integration — Use the 360 I/O pins for parallel interfaces, peripheral aggregation, and complex board-level routing.

Unique Advantages

• High logic capacity: 236,000 logic elements provide room for complex designs and extensive custom hardware acceleration.
• Significant embedded memory: Approximately 13.3 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage needs.
• Generous I/O resources: 360 I/O pins enable broad connectivity without immediate need for external I/O expanders.
• Compact surface-mount package: 780-BBGA (FCBGA) in a 33×33 supplier package helps conserve board space while supporting high pin-count designs.
• Low-voltage core: Core supply range of 820–880 mV assists in board-level power budgeting for modern low-voltage systems.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial electronics applications.

Why Choose 5SGSMD3E2H29C3WN?

The 5SGSMD3E2H29C3WN positions itself as a high-capacity Stratix V GS FPGA for designers who need substantial programmable logic, embedded RAM, and broad I/O connectivity in a compact surface-mount package. Its combination of 236,000 logic elements, approximately 13.3 Mbits of on-chip memory, and 360 I/Os makes it well suited for dense, integrated designs operating in commercial temperature ranges.

Manufactured by Intel and offered in a 780-BBGA FCBGA package, this device is appropriate for development teams and OEMs targeting scalable FPGA-based implementations where on-chip resources and package density are primary selection criteria.

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