5SGSMD3E2H29C2N

The 5SGSMD3E2H29C2N is a Stratix V GS field‑programmable gate array (FPGA) in a 780‑BBGA FCBGA package designed for commercial‑grade applications. It combines a high logic density fabric with abundant embedded memory, variable‑precision DSP resources and integrated transceivers to address transceiver‑based, bandwidth‑centric and DSP‑intensive designs.

This device delivers a balance of on‑chip compute and high‑speed serial connectivity, making it suitable for data‑intensive systems and prototypes that may follow a low‑risk migration path to HardCopy V ASICs as indicated for the Stratix V family.

Key Features

• Logic Capacity — 236,000 logic elements to implement complex digital designs and custom accelerators.
• Embedded Memory — Approximately 13.3 Mbits of on‑chip RAM, implemented using M20K memory blocks as provided across the Stratix V family.
• Variable‑Precision DSP Blocks — GS family DSP resources for high‑performance signal processing; family documentation notes support for large counts of 18×18 and 27×27 multipliers.
• Integrated Transceivers — GS devices include integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interfaces.
• I/O and Packaging — 360 user I/O pins in a 780‑BBGA (FCBGA) package with a 33×33 supplier device footprint.
• Power — Core supply range specified at 870 mV to 930 mV for device operation.
• Clocking & Fabric — Stratix V family features such as adaptive logic modules, multi‑track routing and fractional PLLs are part of the device architecture.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑speed Networking — Implement line cards, packet processors or interface bridging for 40G/100G systems using integrated transceivers and high logic capacity.
• Telecommunications & Optical Systems — Backplane and optical interface designs benefit from the GS transceiver capability and on‑chip DSP resources.
• Signal Processing & HPC — DSP‑centric algorithms and accelerated compute kernels can leverage the device’s variable‑precision DSP blocks and abundant logic elements.
• Prototyping for ASIC Migration — Use for prototyping designs intended for low‑risk migration to hardened HardCopy V ASICs as supported by the Stratix V family flow.

Unique Advantages

• High on‑chip integration: Large logic count plus approximately 13.3 Mbits of embedded memory and M20K blocks reduce reliance on external memory and discrete DSP components.
• Transceiver‑ready fabric: Integrated 14.1‑Gbps transceivers enable direct implementation of high‑bandwidth interfaces without separate PHY chips.
• DSP‑oriented resources: Variable‑precision DSP blocks provide flexible multiplier configurations suited to both fixed‑point and high‑precision signal processing tasks.
• Commercial‑grade reliability: Specified operating range of 0 °C to 85 °C and RoHS compliance support mainstream production deployments.
• Design continuity: Stratix V family architecture elements (ALMs, routing, PLLs, Embedded HardCopy Block) support design portability and potential ASIC conversion paths.

Why Choose 5SGSMD3E2H29C2N?

The 5SGSMD3E2H29C2N positions itself as a capable Stratix V GS device for designers who need a mix of high logic density, substantial on‑chip memory and transceiver‑level connectivity in a commercial‑grade FPGA. Its architecture and family features target transceiver‑based, bandwidth‑centric and DSP‑intensive applications where integrated resources shorten development cycles and reduce board complexity.

For teams prototyping complex communications, signal processing or high‑throughput data designs, this device offers a clear hardware foundation and a documented pathway to HardCopy V ASIC migration as part of the Stratix V ecosystem.

Request a quote or submit an RFQ to obtain pricing and availability for the 5SGSMD3E2H29C2N.