5SGSMD3E2H29C2LN

The 5SGSMD3E2H29C2LN is a Stratix V GS field-programmable gate array (FPGA) supplied in a 780-BBGA (33×33) surface-mount package. It implements a high-density core architecture with 236,000 logic elements and is targeted at transceiver-driven, DSP-centric designs.

With approximately 13.3 Mbits of embedded memory, 360 I/O pins, a variable-precision DSP fabric, and commercial-grade operation from 0 °C to 85 °C, this device is suited for high-bandwidth and data-intensive systems that require dense logic, on-chip memory, and integrated transceiver capability.

Key Features

• Technology and Core  Stratix V family architecture (28‑nm devices) with an enhanced adaptive logic module and multi-track routing architecture for complex logic implementations.
• Logic Capacity  236,000 logic elements providing the resources for large FPGA designs and complex state machines.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM (total RAM bits: 13,312,000) for buffering, packet processing, and large local data storage.
• DSP Resources  Variable-precision DSP blocks (Stratix V GS family) supporting up to 3,926 18×18 or 1,963 27×27 multipliers for compute-intensive signal processing.
• Transceivers  Integrated high-speed transceiver capability consistent with Stratix V GS devices (14.1‑Gbps class), suitable for backplane and optical interface applications.
• I/O and Packaging  360 user I/O pins in a 780‑HBGA (33×33) FCBGA package, surface-mount mounting for compact board-level integration.
• Power and Temperature  Core supply range 820 mV to 880 mV and commercial grade operating range from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Wireline and Telecom Systems  Implement packet processing, backplane interfaces, and protocol handling where dense logic and high-speed transceivers are required.
• Broadcast and Media Processing  Host video and signal-processing pipelines using the device’s sizable DSP fabric and on-chip memory.
• High-Performance Computing (HPC)  Offload compute-intensive kernels and custom data paths leveraging the array of variable-precision DSP blocks and large logic count.
• Military and Defense Communications  Support transceiver-based communications and signal processing functions in commercial‑grade environments where applicable.

Unique Advantages

• High Logic Density:  236,000 logic elements enable complex system integration and large-scale custom logic implementations on a single device.
• Significant On-Chip Memory:  Approximately 13.3 Mbits of embedded RAM reduces external memory dependency for buffers and local storage.
• Rich DSP Capability:  Support for thousands of 18×18 or 27×27 multipliers suits demanding digital signal-processing workloads without excessive IP partitioning.
• Integrated High-Speed Transceivers:  On-chip transceiver capability (Stratix V GS class) facilitates high-bandwidth interfaces for optical and backplane links.
• Compact, Surface-Mount Package:  780‑HBGA (33×33) package with 360 I/Os allows high-density board placement and broad I/O routing options.
• Production Path:  Stratix V family devices offer a low-risk path to HardCopy V ASIC conversion for higher-volume production when required.

Why Choose 5SGSMD3E2H29C2LN?

The 5SGSMD3E2H29C2LN positions Stratix V GS capabilities—large logic capacity, substantial embedded memory, variable‑precision DSP blocks, and integrated transceiver support—into a single, surface-mounted 780‑HBGA package. This combination supports designers building transceiver-based, DSP-centric systems who need dense logic and local memory to minimize board-level complexity.

For commercial applications operating within 0 °C to 85 °C and a core supply of 820–880 mV, this FPGA delivers a scalable platform with documented Stratix V family features and a defined production path for ASIC conversion when higher volumes are required.

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