5SGSMD3E2H29C1WN

The 5SGSMD3E2H29C1WN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in a 780‑BBGA FCBGA package. This high-density programmable device provides a large logic fabric, abundant embedded memory, and a substantial I/O count for complex digital designs.

With 236,000 logic elements, approximately 13.3 Mbits of on‑chip RAM and 360 I/Os, this part is suited for designs that require significant programmable logic capacity, substantial embedded memory, and a moderate I/O complement while operating within commercial temperature and low-voltage core ranges.

Key Features

• Core Logic  236,000 logic elements to implement large-scale custom logic and state machines.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM for FIFOs, buffers, and intermediate data storage.
• I/O Capacity  360 user I/Os to support diverse peripheral interfaces and board-level connectivity.
• Power and Voltage  Core voltage supply range of 870 mV to 930 mV to match low‑voltage FPGA power domains.
• Package & Mounting  780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33); surface‑mount mounting type for PCB assembly.
• Temperature & Grade  Commercial grade with operating temperature from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital designs  Use the large logic element count to consolidate complex state machines, datapaths, and custom hardware accelerators into a single device.
• Embedded memory‑intensive functions  Approximately 13.3 Mbits of on‑chip RAM enables local buffering, packet queuing, and intermediate data storage without immediate external memory.
• I/O‑rich systems  360 I/Os allow interfacing to multiple peripherals, mezzanine connectors, or board-level buses for flexible system integration.

Unique Advantages

• High logic density: 236,000 logic elements enable consolidation of large designs and reduction of multi‑device BOMs.
• Substantial on‑chip RAM: Approximately 13.3 Mbits of embedded memory helps minimize external memory dependencies and lower system latency.
• Generous I/O count: 360 I/Os provide design flexibility for mixed‑signal interfaces, control buses, and parallel connections.
• Compact BGA packaging: 780‑BBGA (33×33) FCBGA footprint supports high integration density on PCBs with surface‑mount assembly.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications.
• RoHS compliant: Environmentally compliant for global standard manufacturing requirements.

Why Choose 5SGSMD3E2H29C1WN?

The 5SGSMD3E2H29C1WN delivers a balance of high logic capacity, sizable embedded memory, and significant I/O in a single Stratix V GS FPGA package. It is positioned for engineers and teams building complex programmable systems that need dense logic resources and on‑chip buffering while operating within commercial temperature ranges.

Backed by Intel’s Stratix V family documentation, this device is a suitable candidate for projects that prioritize integration density and embedded memory without stepping outside standard commercial operating conditions.

If you’d like pricing, availability, or to begin procurement, request a quote or submit an inquiry and our team will assist you with next steps.