5SGSMD3E1H29I2N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 712 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E1H29I2N – Stratix® V GS FPGA, 236,000 logic elements, 360 I/O

The 5SGSMD3E1H29I2N is a Stratix V GS field-programmable gate array in a 780-ball BGA (FCBGA) package. It leverages the Stratix V family architecture—including adaptive logic modules, multi-track routing and comprehensive fabric clocking—to deliver a high-density, DSP-oriented FPGA optimized for transceiver-based, data- and signal-processing applications.

With 236,000 logic elements, approximately 13.3 Mbits of embedded memory and 360 I/O, this device is targeted at bandwidth- and DSP-centric markets such as wireline communications, broadcast, military, and high-performance computing where integrated transceivers and on-chip DSP resources are required.

Key Features

  • Core architecture  28‑nm process Stratix V family features including redesigned adaptive logic modules (ALMs), multi-track routing and a comprehensive fabric clocking network.
  • Logic density  236,000 logic elements to implement complex digital logic and control functions.
  • Embedded memory  Approximately 13.3 Mbits of on-chip RAM arranged in 20-Kbit (M20K) blocks for efficient buffering and state storage.
  • Variable-precision DSP blocks  Abundant DSP resources enabling up to 3,926 18×18 or 1,963 27×27 multipliers suitable for high-performance signal processing.
  • Integrated transceivers  Stratix V GS devices offer integrated transceivers with up to 14.1‑Gbps data rate capability for backplane and optical interfaces.
  • I/O and packaging  360 I/O in a 780-BBGA (FCBGA) supplier package (780‑HBGA, 33×33 mm) optimized for high-density board integration and surface-mount assembly.
  • Power  Core supply range 870 mV to 930 mV to support low-voltage, high-performance operation.
  • Temperature and compliance  Industrial operating range from −40 °C to 100 °C and RoHS compliant.
  • Hard IP and prototyping path  Embedded HardCopy block capability in the Stratix V family enables low-risk prototyping and a migration path to HardCopy ASICs for production scaling.

Typical Applications

  • High-performance networking and transport  Implement packet processing, backplane interfaces and optical transport functions that require high I/O count and integrated transceivers.
  • DSP-centric systems  Use the device’s variable-precision DSP blocks and large embedded memory for signal processing tasks in broadcast and high-performance compute platforms.
  • Military and defense communications  Deploy in environments requiring industrial temperature range and robust FPGA compute and transceiver capability for secure, high-throughput links.
  • ASIC prototyping and volume migration  Prototype system designs on Stratix V GS FPGAs with a documented path to HardCopy V ASICs for lower per-unit cost in production.

Unique Advantages

  • High DSP and logic integration: Combines large DSP block counts with 236,000 logic elements for tightly integrated signal-processing and control logic on a single device.
  • Substantial on-chip memory: Approximately 13.3 Mbits of M20K-based embedded RAM reduces external memory dependency for buffering and state storage.
  • Transceiver-enabled connectivity: Integrated transceivers (14.1‑Gbps capability for GS devices) simplify high-speed serial link implementation for optical and backplane interfaces.
  • Industrial temperature range: Rated from −40 °C to 100 °C to meet deployment requirements across demanding ambient environments.
  • Low-voltage core operation: Operates in the 870–930 mV core supply window to support modern low-voltage system designs.
  • Production scalability: Stratix V family supports a documented migration path to HardCopy ASICs for customers planning higher-volume production.

Why Choose 5SGSMD3E1H29I2N?

The 5SGSMD3E1H29I2N brings a combination of dense logic, large embedded RAM, extensive DSP resources and high-speed transceiver capability in a single industrial-grade Stratix V GS device. Its 360 I/O and 780-ball FCBGA package support complex board-level integration while the family-level architecture—ALMs, M20K memory, fractional PLLs and multi-track routing—provides the building blocks for demanding bandwidth- and compute-intensive designs.

This device is suited to system designers and procurement teams targeting DSP-heavy communications, broadcast, defense or compute platforms that require FPGA-based prototyping with a clear path to ASIC migration and vendor-backed documentation and support.

Request a quote or submit an inquiry to obtain pricing, availability and technical support for the 5SGSMD3E1H29I2N.

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