5SGSMD3E2H29C1N

The 5SGSMD3E2H29C1N is a Stratix V GS field-programmable gate array (FPGA) in a 780-BBGA FCBGA package. It is built on the Stratix V family architecture and targets transceiver-enabled, DSP-centric, and bandwidth-focused applications where high logic capacity and embedded memory are required.

As a member of the Stratix V GS variant, this device combines a high count of logic elements and embedded memory with variable-precision DSP blocks and integrated transceivers to support demanding signal-processing and high-throughput designs.

Key Features

• Core architecture (28‑nm family features) Stratix V family innovations such as an enhanced adaptive logic module (ALM) architecture and comprehensive fabric clocking support high-performance implementations.
• Logic capacity 236,000 logic elements to implement complex logic, control and protocol functions.
• Embedded memory Approximately 13.3 Mbits of on-chip RAM for buffering, packet processing, and local data storage.
• Variable‑precision DSP blocks GS devices include abundant DSP resources suitable for high-performance, precision digital signal processing workloads.
• Integrated transceivers Stratix V GS devices offer integrated transceiver capability with 14.1‑Gbps data rate support for high-speed serial interfaces and backplane/optical links.
• I/O and package 360 I/Os in a 780‑BBGA FCBGA package (supplier package: 780‑HBGA, 33×33) for dense board-level integration.
• Power Core supply range 870 mV to 930 mV to support the device’s operating requirements.
• Operating range and grade Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
• Hard IP and prototyping path Supports Embedded HardCopy Block capabilities and a documented low-risk prototyping path to HardCopy V ASICs for volume migration.

Typical Applications

• High‑performance DSP systems — Implement variable‑precision filtering, multi-rate signal chains, and accelerator functions using the device’s dense DSP blocks and on-chip memory.
• Optical and backplane communications — Leverage integrated 14.1‑Gbps transceivers for 40G/100G and other high‑bandwidth transport interfaces.
• Network and packet processing — Use high logic capacity and embedded RAM for packet buffering, classification, and traffic management tasks.
• PCIe‑based subsystems — Family support for PCI Express Gen3 hard IP makes the device suitable for PCIe endpoint or bridge implementations in systems requiring high I/O throughput.

Unique Advantages

• High integration density: 236,000 logic elements and ~13.3 Mbits of embedded memory reduce external component count and simplify board design.
• Transceiver-enabled throughput: Integrated 14.1‑Gbps transceivers enable high-speed serial interfaces without added PHY components.
• Optimized for DSP workloads: Abundant variable-precision DSP resources support demanding signal-processing algorithms and accelerators.
• Commercial temperature and RoHS compliance: Designed for standard commercial environments with regulatory-compliant manufacturing.
• Package density: 780‑BBGA (780‑HBGA supplier package, 33×33) balances pin count and board area for compact, high‑I/O designs.
• Volume migration path: Supported path to HardCopy V ASICs for cost-effective production scaling and lower unit cost in high volumes.

Why Choose 5SGSMD3E2H29C1N?

This Stratix V GS device combines large logic capacity, significant embedded memory, and integrated high-speed transceivers to address bandwidth-centric and DSP-focused applications. It is well suited for engineers building high-throughput communications, packet processing, and compute‑accelerated systems that require on-chip processing and low-latency data movement.

With commercial-grade operation, a compact 780‑BBGA package, and a defined prototyping-to-ASIC path, the 5SGSMD3E2H29C1N delivers a scalable platform for development through production while reducing board-level complexity.

Request a quote or submit a pricing inquiry to check availability, lead times, and volume pricing for the 5SGSMD3E2H29C1N.