5SGSMD3E2H29C2G

The 5SGSMD3E2H29C2G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel designed for applications requiring high logic density, substantial on-chip memory, and a large I/O complement. As a commercial-grade Stratix V GS device, it combines abundant logic elements and embedded RAM with a high-pin-count BGA package to support complex digital designs.

Key attributes include approximately 236,000 logic elements, approximately 13.312 Mbits of embedded memory, and 360 I/Os, providing the raw resources needed for demanding custom logic, buffering, and interfacing tasks while meeting RoHS compliance.

Key Features

• Core Logic  Approximately 236,000 logic elements to implement large combinational and sequential logic functions.
• Embedded Memory  Approximately 13.312 Mbits of total on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Capacity  360 user I/Os to support high-pin-count designs and multiple parallel interfaces.
• Power Supply  Core voltage range specified at 870 mV to 930 mV for the device core supply.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type suitable for modern PCB assembly.
• Temperature Grade  Commercial operating temperature range from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital systems  Implement large custom logic blocks and control engines that require extensive logic resources and on-chip RAM.
• I/O-intensive interface hubs  Use the 360 I/Os to aggregate multiple parallel interfaces, protocol converters, or board-level glue logic.
• Memory-buffered data paths  Leverage the device's embedded RAM for packet buffering, temporary storage, and pipeline staging in data processing flows.

Unique Advantages

• High logic capacity: The large logic element count enables integration of complex functions and multiple subsystems on a single FPGA, reducing component count.
• Substantial on-chip RAM: Approximately 13.312 Mbits of embedded memory supports local buffering and low-latency storage without relying solely on external memory.
• Generous I/O resources: 360 I/Os provide flexibility for parallel interfaces, signaling domains, and board-level connectivity.
• Compact BGA package: The 780-BBGA (33×33) package balances pin density with board-area efficiency for space-constrained designs.
• Commercial-grade operating range: Specified 0 °C to 85 °C operating temperature suitable for a wide range of standard electronic applications.
• RoHS compliant: Meets RoHS requirements for restricted substances.

Why Choose 5SGSMD3E2H29C2G?

This Stratix® V GS FPGA delivers a combination of high logic density, ample embedded memory, and extensive I/O in a compact 780-BBGA package, making it well suited for designs that consolidate complex digital functions and require significant on-chip buffering. Its commercial temperature rating and RoHS compliance make it appropriate for a broad range of standard electronic products where reliability and manufacturability are required.

Designed for engineers and system architects who need to collapse multiple discrete functions into a single programmable device, the 5SGSMD3E2H29C2G supports scalable design approaches and benefits from the Stratix V family design documentation and tooling.

Request a quote or submit a pricing and availability request for part number 5SGSMD3E2H29C2G to get detailed lead-time and procurement information.