5SGSMD3E2H29C2LG

The 5SGSMD3E2H29C2LG is a Stratix V GS series Field Programmable Gate Array (FPGA) offered in a 780-ball BGA package. As a commercial-grade Stratix V GS device, it delivers a large pool of programmable logic, embedded memory, and a high count of I/O for complex system integration.

Designed for applications that require dense logic resources and substantial on-chip RAM, this device balances integration and power by specifying a core supply range of 820 mV to 880 mV and commercial operating temperatures from 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 236,000 logic elements for implementing complex digital designs and large-scale logic functions.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage.
• I/O Resources  360 I/O pins to interface with peripherals, memory, and high-speed system buses.
• Package and Mounting  780-ball BGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting for PCB assembly.
• Power and Operating Conditions  Core voltage supply range: 820 mV to 880 mV. Commercial operating temperature range: 0 °C to 85 °C. Grade: Commercial.
• Standards Compliance  RoHS compliant.
• Series-Level Performance Options  Stratix V GS devices are offered with commercial and industrial speed-grade options at the series level, as documented in the Stratix V device datasheet.

Typical Applications

• High-density logic implementations  Leverage 236,000 logic elements for custom compute engines, complex state machines, and protocol processing.
• On-chip buffering and data handling  Approximately 13.3 Mbits of embedded RAM supports packet buffering, FIFOs, and intermediate data storage.
• System I/O aggregation  360 I/O pins enable broad peripheral connectivity and multi-channel interfacing for mixed-signal front ends or high-pin-count subsystems.

Unique Advantages

• High logic density: 236,000 logic elements enable consolidation of multiple functions onto a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces external memory dependency for many buffering and streaming tasks.
• Generous I/O count: 360 I/O pins support complex system interconnect and flexible interface partitioning.
• Commercial-grade operating window: Specified for 0 °C to 85 °C operation to match standard commercial deployments and production environments.
• Industry-standard BGA packaging: 780-BBGA/780-HBGA (33×33) form factor provides a compact, solderable package for surface-mount assembly.
• Regulatory compliance: RoHS-compliant construction supports modern electronics manufacturing requirements.

Why Choose 5SGSMD3E2H29C2LG?

The 5SGSMD3E2H29C2LG from the Stratix V GS family provides a substantial combination of logic elements, embedded memory, and I/O capacity in a compact 780-ball BGA package. Its commercial-grade specification and defined core supply range make it suitable for high-density designs where integration and on-chip resources reduce external BOM and simplify system architecture.

This device is well suited to design teams and OEMs building complex FPGA-based subsystems that require significant on-chip resources and flexible I/O. Backed by the Stratix V series documentation and configuration options, it offers a scalable platform for evolving product requirements.

Request a quote or submit a pricing inquiry for the 5SGSMD3E2H29C2LG to get availability and lead-time information specific to your program needs.