5SGSMD3E1H29C2WN

The 5SGSMD3E1H29C2WN is a Stratix V GS series Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 780-ball FCBGA package. This commercial-grade device delivers large programmable logic capacity, substantial on-chip RAM, and a high I/O count for designs that require significant integration of digital logic and memory.

Key device parameters include 236,000 logic elements, approximately 13.3 Mbits of embedded memory, 360 I/Os, and a supplier package of 780-HBGA (33×33). The device is RoHS compliant and rated for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic Capacity  236,000 logic elements provide a large programmable fabric for complex digital designs and custom logic implementation.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support data buffering, on-chip storage, and local memory structures.
• I/O  360 programmable I/O pins to support dense board-level connectivity and multiple interfaces.
• Package and Mounting  780-BBGA / FCBGA package with supplier device package 780-HBGA (33×33) for surface-mount assembly.
• Supply Voltage  Core supply range specified at 870 mV to 930 mV for device operation.
• Operating Temperature  Commercial temperature grade rated from 0 °C to 85 °C.
• Compliance  RoHS compliant to meet standard environmental requirements for electronic assembly.

Typical Applications

• High-density digital processing  Use where large programmable logic resources (236,000 logic elements) and significant embedded memory are required for custom algorithms and data-paths.
• Multi-I/O systems  Ideal for designs needing 360 I/Os to interface with multiple peripherals, sensors, or board-level subsystems.
• On-chip buffering and storage  Leverage approximately 13.3 Mbits of embedded RAM for local buffering, packet queues, or scratch memory.
• Board-level integration  Surface-mount 780-BBGA FCBGA package supports compact, high-density PCB layouts where a high-pin-count FPGA is required.

Unique Advantages

• Large programmable fabric: 236,000 logic elements enable consolidation of complex logic into a single device, reducing the need for multiple discrete components.
• Substantial on-chip RAM: Approximately 13.3 Mbits of embedded memory supports local data storage and reduces external memory bandwidth requirements.
• High I/O count: 360 I/Os provide flexibility for parallel interfaces, multiple peripherals, and high-pin-count system requirements.
• Commercial temperature rating: Operates across 0 °C to 85 °C for designs targeting commercial environments.
• Standard surface-mount package: 780-HBGA (33×33) supplier package allows integration into compact, high-density PCBs while supporting automated assembly processes.
• Regulatory readiness: RoHS compliance simplifies environmental compliance for assembled products.

Why Choose 5SGSMD3E1H29C2WN?

The 5SGSMD3E1H29C2WN delivers a balanced combination of large logic capacity, significant embedded memory, and extensive I/O resources in a 780-ball FCBGA package. Its specifications make it suitable for commercial designs that require high integration of programmable logic and on-chip memory while maintaining a compact board footprint.

This Stratix V GS device is appropriate for design teams and procurement organizations targeting robust, RoHS-compliant FPGA solutions with clear electrical and packaging specifications. The device benefits from documented Stratix V family electrical characteristics and vendor-supplied datasheet guidance for implementation and operating conditions.

Request a quote or submit a purchase inquiry to evaluate the 5SGSMD3E1H29C2WN for your next design.